Low-profile MEMS thermal printhead die having backside electrical connections
First Claim
1. A thermal printhead die, comprising:
- an SOI structure having a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface;
a plurality of ink delivery sites, each site having an ink-receiving and ink-dispensing structure formed on the printing surface, andan ohmic heater formed adjacent to the ink-receiving and ink-dispensing structure; and
at least one under-bump metallization (“
UBM”
) pad formed on the mounting surface and electrically connected to the ohmic heater; and
at least one through-silicon via (“
TSV”
) plug electrically coupling the ohmic heater to the at least one UBM pad through the buried oxide layer.
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Accused Products
Abstract
A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
136 Citations
10 Claims
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1. A thermal printhead die, comprising:
-
an SOI structure having a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface; a plurality of ink delivery sites, each site having an ink-receiving and ink-dispensing structure formed on the printing surface, and an ohmic heater formed adjacent to the ink-receiving and ink-dispensing structure; and at least one under-bump metallization (“
UBM”
) pad formed on the mounting surface and electrically connected to the ohmic heater; andat least one through-silicon via (“
TSV”
) plug electrically coupling the ohmic heater to the at least one UBM pad through the buried oxide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification