Solid state lighting units and methods of forming solid state lighting units

• US 8,556,464 B2
• Filed: 05/31/2011
• Issued: 10/15/2013
• Est. Priority Date: 11/18/2005
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Roberts, John K., Sims, Paul E., You, Chenhua
• Primary Examiner(s): Alavi, Ali
• Application Number:
  US13/149,212
• Publication Number:
  US 20110228530A1
• Time in Patent Office: 868 Days
• Field of Search: 362/249.02, 362/367
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133613 characterized by the sequence of light sources
• CPC Class Codes: G09F 9/35 being liquid crystals G09F9/302 takes precedence; liquid crystal materials C09K19/00; liquid crystal panels comprising a number of electrodes in a single cell per se G02F1/13
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/206 Length ranges
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A solid state lighting unit includes a plurality of solid state lighting tiles including a planar surface and a plurality of solid state light sources on the planar surface. The lighting unit includes a plurality of bar support members. Respective ones of the bar support members include at least two of the plurality of tiles affixed thereon to form respective bar assemblies, and respective ones of the solid state light sources on the solid state lighting tiles of a bar assembly are electrically connected in series so as to be simultaneously energized upon application of a voltage thereto. Methods of forming a solid state lighting unit are also disclosed.

Claims

1. A solid state lighting unit, comprising:

a plurality of solid state lighting tiles, each of the solid state lighting tiles comprising a planar surface and a plurality of solid state light sources on the planar surface, wherein the solid state lighting tiles are arranged into respective rows of tiles;

wherein respective ones of the solid state light sources on the solid state lighting tiles of a row of tiles are electrically connected in series so as to be simultaneously energized upon application of a voltage thereto.

2. The solid state lighting unit of claim 1, further comprising:

a panel support member, wherein the plurality of rows of tiles are affixed to the panel support member.

3. The solid state lighting unit of claim 1, wherein the panel support member comprises a cover bottom affixed to the plurality of solid state lighting tiles.

4. The solid state lighting unit of claim 3, further comprising a thermal spreader on the cover bottom.

5. The solid state lighting unit of claim 4, wherein the thermal spreader comprises a sheet of thermally conductive material having an area and configured to conduct heat generated by the solid state lighting devices to the cover bottom and to reduce thermal nonuniformities in the solid state lighting unit by spreading the conducted heat over the area of the thermal spreader.

6. The solid state lighting unit of claim 4, wherein the thermal spreader is between the cover bottom and the plurality of solid state lighting tiles.

7. The solid state lighting unit of claim 4, wherein the cover bottom is between the thermal spreader and the plurality of bar assemblies.

8. The solid state lighting unit of claim 4, wherein the thermal spreader comprises a first thermal spreader between the cover bottom and the plurality of solid state lighting tiles, the solid state lighting unit further comprising a second thermal spreader, wherein the cover bottom is between the first thermal spreader and the second thermal spreader.

9. The solid state lighting unit of claim 1, further comprising a plurality of nonconductive elastomeric spacers between adjacent ones of the solid state lighting tiles.

10. The solid state lighting unit of claim 9, wherein each of the plurality of spacers comprises a protrusion configured to mate with a corresponding recess in at least one of the adjacent solid state lighting tiles.

11. A solid state lighting unit, comprising:

a panel support member;

a plurality of solid state lighting tiles, each of the solid state lighting tiles comprising a planar surface and a plurality of solid state light sources on the planar surface, wherein the solid state lighting tiles are connected in respective rows of solid state lighting tiles; and

wherein the solid state lighting tiles are mounted on the panel support member.

12. The solid state lighting unit of claim 11, further comprising a thermal spreader between the panel support member and the plurality of solid state lighting tiles, wherein the thermal spreader comprises a sheet of thermally conductive material having an area and configured to conduct heat generated by the solid state lighting devices to the panel support member and to reduce thermal nonuniformities in the solid state lighting unit by spreading the conducted heat over the area of the thermal spreader.

13. The solid state lighting unit of claim 12, further comprising a reflector panel on the plurality of lighting tiles.

14. The solid state lighting unit of claim 13, further comprising a plurality of pins comprising a body and a head, wherein reflector panel is attached to the tiles using the pins, wherein the pins extend through a hole in the reflector panel and into a corresponding hole in a tile.

15. A solid state lighting unit comprising:

a panel support member;

first and second solid state lighting tiles on the panel support member;

a nonconductive elastomeric spacer between the first and second solid state lighting tiles.

16. The solid state lighting unit of claim 15, wherein the spacer comprises a protrusion configured to mate with a corresponding recess in at least one of the first or second solid state lighting tiles.

17. The solid state lighting unit of claim 15, further comprising:

electrical pads on surfaces of the first and second tiles opposite the bar support member; and

a wire loop extending between the electrical pads to electrically interconnect the electrical pads across the spacer.

18. The solid state lighting unit of claim 17, wherein the height of the wire loop from the planar surface is between about 0.02 and about 0.12 inches.

19. The solid state lighting unit of claim 17, further comprising:

a plurality of parallel wire loops extending between the electrical pads to provide a redundant electrical interconnection between the electrical pads.