Method for bonding a layer of silicone to a substrate of methacrylate polymer
First Claim
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1. A method for bonding a substrate with at least one layer of silicone in order to obtain a composite, comprising:
- a first phase of application, during which a first layer comprising at least one organosilane is applied to at least one first surface of the substrate;
a second phase of application, during which a second layer comprising silicone is applied on the first layer, wherein the organosilane has, during the second phase of application, at least one silicon bonded with at least one hydroxy;
a phase of surface treatment, which precedes the first phase of application and during which at least either the first or a second surface of the substrate is treated so that the first surface has an angle of contact greater than an angle of contact of the second surface, wherein during the first phase of application, the organosilane deposits selectively on the first surface with respect to the second surface.
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Abstract
Method of bonding a layer (S) of silicone to a substrate (4′) of methacrylic polymer; the method involves positioning between the methacrylate polymer and the silicone a layer (9) of an organosilane having the formula R1Si(R2)3, in which R2 is OH and R1 is a methacrylic residue.
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Citations
17 Claims
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1. A method for bonding a substrate with at least one layer of silicone in order to obtain a composite, comprising:
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a first phase of application, during which a first layer comprising at least one organosilane is applied to at least one first surface of the substrate; a second phase of application, during which a second layer comprising silicone is applied on the first layer, wherein the organosilane has, during the second phase of application, at least one silicon bonded with at least one hydroxy; a phase of surface treatment, which precedes the first phase of application and during which at least either the first or a second surface of the substrate is treated so that the first surface has an angle of contact greater than an angle of contact of the second surface, wherein during the first phase of application, the organosilane deposits selectively on the first surface with respect to the second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for bonding a substrate with at least one layer of silicone in order to obtain a composite, comprising:
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a first phase of application, during which a first layer comprising at least one organosilane is applied to at least one first surface of the substrate; a second phase of application, during which a second layer comprising silicone is applied on the first layer, wherein the organosilane has, during the second phase of application, at least one silicon bonded with at least one hydroxyl, and during the first phase of application, the organosilane deposits on the first and a second surface; and a phase of removal, during which the organosilane is selectively removed from the second surface while remaining on the first surface, wherein the organosilane is removed from the second surface by means of plasma incision.
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Specification