Method of manufacturing light emitting diode package
First Claim
1. A method of manufacturing a light emitting diode package comprising:
- preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;
mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;
injecting a liquid-state transparent resin into the recess of the package structure;
curing the injected liquid-state transparent resin until the injected liquid-state transparent resin is in a partially cured state;
applying a stamp with a micro rough pattern engraved thereon to an upper surface of the partially cured liquid-state transparent resin before the liquid-state transparent resin is completely cured;
curing the partially cured liquid-state transparent resin with the stamp applied thereto completely to form a resin encapsulant; and
removing the stamp from the resin encapsulant.
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Accused Products
Abstract
A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
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Citations
10 Claims
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1. A method of manufacturing a light emitting diode package comprising:
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preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess; mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure; injecting a liquid-state transparent resin into the recess of the package structure; curing the injected liquid-state transparent resin until the injected liquid-state transparent resin is in a partially cured state; applying a stamp with a micro rough pattern engraved thereon to an upper surface of the partially cured liquid-state transparent resin before the liquid-state transparent resin is completely cured; curing the partially cured liquid-state transparent resin with the stamp applied thereto completely to form a resin encapsulant; and removing the stamp from the resin encapsulant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification