Method for fabrication of a semiconductor device and structure
First Claim
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1. A method to process an Integrated Circuit device comprising:
- processing a first layer of first transistors, thenprocessing a first metal layer overlaying said first transistors and providing at least one connection to said first transistors, thenprocessing a second metal layer overlaying said first metal layer, thenprocessing a second layer of second transistors overlaying said second metal layer, whereinsaid second metal layer is connected to provide power to at least one of said second transistors.
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Abstract
A method to process an Integrated Circuit device including processing a first layer of first transistors, then processing a first metal layer overlaying the first transistors and providing at least one connection to the first transistors, then processing a second metal layer overlaying the first metal layer, then processing a second layer of second transistors overlaying the second metal layer, wherein the second metal layer is connected to provide power to at least one of the second transistors.
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Citations
30 Claims
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1. A method to process an Integrated Circuit device comprising:
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processing a first layer of first transistors, then processing a first metal layer overlaying said first transistors and providing at least one connection to said first transistors, then processing a second metal layer overlaying said first metal layer, then processing a second layer of second transistors overlaying said second metal layer, wherein said second metal layer is connected to provide power to at least one of said second transistors. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method to process an Integrated Circuit device comprising:
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processing a first layer of first transistors, then processing a first metal layer overlaying said first transistors and providing at least one connection to said first transistors, then processing a second metal layer overlaying said first metal layer, then processing a second layer of second transistors overlaying said second metal layer, then processing a third metal layer overlying said second transistors, wherein at least one of said second transistors is provided with a back-bias. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method to process an Integrated Circuit device comprising:
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processing a first layer of first transistors, then processing a first metal layer overlaying said first transistors and providing at least one connection to said first transistors, then processing a second metal layer overlaying said first metal layer, then processing a second layer of second transistors overlaying said second metal layer, comprising forming at least one connection path between said second transistors and said second metal layer, wherein said connection path comprises at least one through-layer via, and wherein said through-layer via comprises material whose co-efficient of thermal expansion is within 50 percent of a coefficient of thermal expansion of said second layer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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24. A method to process an Integrated Circuit device comprising:
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processing a first layer of first transistors, then processing a first metal layer overlaying said first transistors and providing at least one connection to said first transistors, then processing a second metal layer overlaying said first metal layer, then processing a second layer of second transistors overlaying said second metal layer, then processing a third metal layer overlying said second transistors, wherein at least one of said second transistors is one of; (i) a replacement-gate transistor; (ii) a Finfet transistor;
or(iii) a double gate horizontally oriented transistor. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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Specification