×

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

  • US 8,557,680 B2
  • Filed: 07/10/2012
  • Issued: 10/15/2013
  • Est. Priority Date: 08/26/2009
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor manufacturing process for wafer-to-wafer bonding of a first wafer having a first plurality of dies of a first die size to a reconstituted wafer having a second plurality of dies of a second die size different than the first die size, the process comprising:

  • aligning the second plurality of dies, having a spacing between the second plurality of dies based on parameters of the first plurality of dies, such that a second plurality of interconnects on the second plurality of dies aligns with a first plurality of interconnects on the first plurality of dies; and

    coupling the reconstituted wafer with the first wafer to create a wafer stack.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×