Rectifier structures for AC LED systems

• US 8,558,249 B1
• Filed: 06/30/2009
• Issued: 10/15/2013
• Est. Priority Date: 06/30/2009
• Status: Expired due to Fees

• Current Assignee: Applied Lighting Solutions, LLC
• Original Assignee: Applied Lighting Solutions, LLC
• Inventors: Shum, Frank
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US12/494,685
• Time in Patent Office: 1,568 Days
• Field of Search: 257/88, 257/100
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 28/20 Resistors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A space efficient arrangement of at least one LED with a rectifying element and a current limiting element forms a compact module that can be powered using an AC voltage source.

Claims

1. A system comprising a packaged component comprising:

an AC power input to the packaged component;

a first die comprising a first light emitting diode;

a second die comprising of a second light emitting diode;

a third die comprising a silicon rectifying element,

wherein the third die is electrically coupled to the first and second die,

the first and second dies are electrically coupled to produce a combined forward voltage greater than the forward voltage of either the first or second die,

a first current limiting element, comprising a first terminal coupled to the AC power input and a second terminal coupled to the rectifying element, and

the first, second, and third dies are formed on a one side of a planar substrate; and

a second current limiting element, comprising a first terminal coupled to the rectifying element and a second terminal coupled to the second light emitting diode.

2. The system of claim 1 wherein the first current limiting element comprises a resistor.

3. The system of claim 1 wherein the first current limiting element comprises a capacitor.

4. The system of claim 1 wherein the first and second dies and the rectifying element are encapsulated together using a light transmitting medium.

5. The system of claim 1 wherein the first and second dies are encapsulated together using a first medium, and the rectifying element is encapsulated using a second medium, wherein the second medium is separate from the first medium.

6. The system of claim 5 wherein the first medium is light transmitting.

8. The system of claim 6 wherein the first die and the rectifying element are encapsulated together using a light transmitting medium.

9. The system of claim 1 wherein the first die is encapsulated using a first medium and the rectifying element is encapsulated using a second medium, wherein the second medium is separate from the first medium.

10. The system of claim 1 wherein the first and second light emitting diodes are coupled together in series.

11. The system of claim 1 wherein the first and second light emitting diodes are coupled together in parallel.

20. The system of claim 1 wherein the first terminal of the second current limiting element is coupled to the first light emitting diode.

7. A system comprising a packaged component comprising:

an AC power input to the packaged component;

a first die comprising a first light emitting diode;

a second die comprising of a second light emitting diode; and

a third die comprising a silicon rectifying element,

wherein the third die is electrically coupled to the first and second die,

the first and second dies are electrically coupled to produce a combined forward voltage greater than the forward voltage of either the first or second die,

a current limiting element, comprising a first terminal coupled to a first node of the rectifying element and a second terminal coupled to a second node of the rectifying element,

the first and second dies are encapsulated together using a first medium, and the rectifying element is encapsulated using a second medium, wherein the second medium is separate from the first medium, and

the second medium is not light transmitting.

12. The system of claim 7 wherein the current limiting element comprises a resistor that is encapsulated in medium is not light transmitting.

18. The system of claim 7 wherein the second terminal of the current limiting element is coupled to the first light emitting diode.

19. The system of claim 7 wherein the current limiting element is a first the current limiting element, and the system comprises:

a second current limiting element, comprising a first terminal coupled to the rectifying element and a second terminal coupled to the second light emitting diode.

13. A system comprising a packaged component comprising:

an AC power input to the packaged component;

a first die comprising a of a first light emitting diode;

a second die comprising of a second light emitting diode; and

a third die comprising a silicon rectifying element rectifier,

wherein the third die is electrically coupled to the first and second die,

the first and second dies are electrically coupled to produce a combined forward voltage greater than the forward voltage of either the first or second die,

a current limiting element, comprising a first terminal coupled to the AC power input and a second terminal coupled to the AC power input,

the first, second, and third dies are formed on a one side of a planar substrate, and

the first, second, and third dies are encapsulated together using a light transmitting medium.

14. The system of claim 13 wherein the light transmitting medium comprises a convex lens above the surface of the first, second, and third dies.

15. The system of claim 13 wherein the AC power input is coupled to the third die via a first wire bond, the third die is coupled to the first die via a second wire bond, and the first die is coupled to the second die via a third wire bond.

16. The system of claim 13 wherein the first die comprises a third light emitting diode coupled in series with the first light emitting diode.

17. The system of claim 13 wherein the first terminal of the current limiting element is coupled to a positive electrode of the AC power input and the second terminal of the current limiting element is coupled to a negative electrode of the AC power input.