Actuator mount system

• US 8,562,336 B2
• Filed: 05/01/2012
• Issued: 10/22/2013
• Est. Priority Date: 03/25/2010
• Status: Active Grant

• Current Assignee: Synventive Molding Solutions Incorporated
• Original Assignee: Synventive Molding Solutions Incorporated
• Inventors: Lee, Christopher
• Primary Examiner(s): HEITBRINK, TIMOTHY W
• Application Number:
  US13/461,081
• Publication Number:
  US 20120231109A1
• Time in Patent Office: 539 Days
• Field of Search: 425/562, 425/563, 425/564, 425/572
• US Class Current: 425/564
• CPC Class Codes: B23P 17/04 characterised by the nature of the material involved or the kind of product independently of its shape
• CPC Class Codes: B29C 2045/277 Spacer means or pressure pads between manifold and mould plates
• CPC Class Codes: B29C 45/2725 Manifolds
• CPC Class Codes: B29C 45/2737 Heating or cooling means therefor B29C45/7331 takes precedence
• CPC Class Codes: B29C 45/281 Drive means therefor
• CPC Class Codes: B29C 45/7331 Heat transfer elements, e.g. heat pipes
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A system for mounting an injection molding system actuator to a manifold and a clamp plate comprising:

• • a mount comprised of a thermally conductive material having first and second thermally conductive surfaces, the actuator being mounted to the first thermally conductive surface in thermal communication with the second thermally conductive surface,
  • the clamp plate being mounted in thermal communication with the second thermally conductive surface,
  • the actuator being mounted in thermal communication with the heated manifold;
  • wherein the clamp plate, manifold and mold are assembled together with the actuator and the mount in an assembled operating arrangement such that the second thermally conductive surface is in compressed contact with the clamp plate under a spring force.

Claims

1. In an injection molding apparatus comprising a clamp plate, a heated manifold and a mold, a system for mounting an actuator to the manifold and the clamp plate, the system comprising:

a mounting plate comprised of a thermally conductive material having first and second opposing surfaces disposed between the heated manifold and the actuator, the actuator being mounted to the mounting plate in thermal communication with the first opposing surface, the manifold being mounted in thermal communication with the second opposing surface of the mounting plate;

the mounting plate having one or more third thermally conductive surfaces in thermal communication with the clamp plate;

wherein the clamp plate, manifold and mold are assembled together with the actuator and the mounting plate in an assembled operating arrangement such that the third thermally conductive surfaces of the mount are in compressed contact with the clamp plate under a spring force.

2. The apparatus of claim 1 wherein the spring force is created by deformation of a portion of the mounting plate.

3. The apparatus of claim 1 wherein the manifold is raised to an elevated temperature above about 300 degrees F., the clamping plate being cooled to a temperature of less than about 150 degrees F.

4. The apparatus of claim 1 including a thermally conductive cooling device having first and second mounting surfaces disposed between the second mounting surface of the mounting plate and the heated manifold, the mounting plate being mounted in thermally conductive communication with the first mounting surface of the cooling device and the manifold being mounted in thermally conductive communication with the second mounting surface of the cooling device.

5. The apparatus of claim 4 wherein the cooling device comprises a thermally conductive metal device that is cooled to a temperature of less than about 150 degrees F.

6. The apparatus of claim 1 wherein the mounting plate comprises a plate having a primary mounting surface that receives and engages a body surface of the actuator, the plate having projections that are arranged and configured to extend beyond the engaged body surface of the actuator such that the projections of the plate are formed into the third surfaces of the plate that laterally extend into thermally conductive contact engagement with one or more body surfaces of the clamp plate.

7. The apparatus of claim 1 wherein the projections of the mounting plate comprise a spring, the clamp plate, the mold, the manifold, the actuator and the mount being assembled together in an arrangement wherein the spring is loaded urging the third surfaces into compressed engagement with the clamp plate.

8. The apparatus of claim 1 wherein the clamp plate is mounted in a position upstream from and in spaced thermal isolation from the manifold.

9. The apparatus of claim 1 wherein the actuator is connected to a valve pin that is mounted to and extends through a fluid material feed bore in the manifold.

10. In an injection molding apparatus comprising a clamp plate, a heated manifold and a mold, a system for mounting an actuator to the manifold and the clamp plate, the system comprising:

a mounting plate comprised of a thermally conductive material having first and second thermally conductive surfaces in thermal communication with each other, the actuator being mounted to the first thermally conductive surface in thermal communication with the second thermally conductive surface,

the clamp plate being mounted in thermal communication with the second thermally conductive surface,

the actuator being mounted in thermal communication with the heated manifold;

wherein the clamp plate, manifold and mold are assembled together with the actuator and the mounting plate in an assembled operating arrangement such that the second thermally conductive surface is in compressed contact with the clamp plate under a spring force.

11. The apparatus of claim 10 wherein the spring force is created by deformation of a portion of the mount.

12. The apparatus of claim 10 wherein the manifold is raised to an elevated temperature above about 300 degrees F., the clamping plate being cooled to a temperature of less than about 150 degrees F.

13. The apparatus of claim 10 including a thermally conductive cooling device having first and second mounting surfaces disposed between the actuator and the heated manifold, the actuator being mounted in thermally conductive communication with a first mounting surface of the cooling device and the manifold being mounted in thermally conductive communication with a second mounting surface of the cooling device.

14. The apparatus of claim 13 wherein the cooling device comprises a thermally conductive metal device that is cooled to a temperature of less than about 150 degrees F.

15. The apparatus of claim 10 wherein the mounting plate comprises a plate having a primary mounting surface that receives and engages a body surface of the actuator, the plate having projections that are arranged and configured to extend beyond the engaged body surface of the actuator such that the projections of the plate are formed into the second thermally conductive surfaces of the plate that laterally extend into thermally conductive contact engagement with one or more body surfaces of the clamp plate.

16. The apparatus of claim 15 wherein the projections of the mounting plate comprise a spring, the clamp plate, the mold, the manifold, the actuator and the mounting plate being assembled together in an arrangement wherein the spring is loaded urging the second thermally conductive surfaces into compressed engagement with the clamp plate.

17. The apparatus of claim 10 wherein the clamp plate is mounted in a position upstream from and in spaced thermal isolation from the manifold.

18. The apparatus of claim 10 wherein the actuator is connected to a valve pin that is mounted to and extends through a fluid material feed bore in the manifold.