Film formation method, film formation device, piezoelectric film, piezoelectric device and liquid discharge device
First Claim
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1. A film formation method for forming a film on a substrate, the method comprising:
- placing a substrate and a target comprising film constituent elements such that the substrate and the target face each other;
surrounding the substrate with a wall surface; and
subjecting the substrate and the target to a vapor deposition process using plasma to form the film, wherein the film is formed while physical treatment is applied to the wall surface to cause an element or elements that emerge from a part of the formed film and adhere to the wall surface during the vapor deposition process, to be released from the wall surface into a film formation atmosphere, wherein the wall surface comprisesan inner wall surface of a vacuum vessel in which the film is formed, ora surface of a wall member which surrounds the side surface of the substrate and is disposed between the substrate and the vacuum vessel.
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Abstract
When a film containing constituent elements of a target is formed on a substrate through a vapor deposition process using plasma with placing the substrate and the target to face to each other, the film is formed with surrounding the substrate with a wall surface having the constituent elements of the target adhering thereto, and applying a physical treatment to the wall surface to cause the components adhering to the wall surface to be released into the film formation atmosphere.
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Citations
17 Claims
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1. A film formation method for forming a film on a substrate, the method comprising:
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placing a substrate and a target comprising film constituent elements such that the substrate and the target face each other; surrounding the substrate with a wall surface; and subjecting the substrate and the target to a vapor deposition process using plasma to form the film, wherein the film is formed while physical treatment is applied to the wall surface to cause an element or elements that emerge from a part of the formed film and adhere to the wall surface during the vapor deposition process, to be released from the wall surface into a film formation atmosphere, wherein the wall surface comprises an inner wall surface of a vacuum vessel in which the film is formed, or a surface of a wall member which surrounds the side surface of the substrate and is disposed between the substrate and the vacuum vessel. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification