Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last
First Claim
1. A method, comprising:
- forming a first integrated circuit (IC) device having a first substrate, an alignment via defined in the first substrate, a first wiring layer over the alignment via, and a first bonding layer over the first wiring layer;
forming a second IC device having a second substrate, a second wiring layer over the second substrate, and a second bonding layer over the second wiring layer;
bonding the first bonding layer of first IC device to the second bonding layer of second IC device;
thinning a backside of the first IC device so as to expose the alignment via; and
using the exposed alignment via to form a deep, through substrate via (TSV) that passes through the first IC device, through a bonding interface between the first IC device and second IC device, and landing on the second wiring layer of the second IC device.
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Abstract
A method includes forming a first integrated circuit (IC) device having a first substrate, an alignment via defined in the first substrate, a first wiring layer over the alignment via, and a first bonding layer over the first wiring layer; forming a second IC device having a second substrate, a second wiring layer over the second substrate, and a second bonding layer over the second wiring layer; bonding the first bonding layer of first IC device to the second bonding layer of second IC device; thinning a backside of the first IC device so as to expose the alignment via; and using the exposed alignment via to form a deep, through substrate via (TSV) that passes through the first IC device, through a bonding interface between the first IC device and second IC device, and landing on the second wiring layer of the second IC device.
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Citations
20 Claims
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1. A method, comprising:
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forming a first integrated circuit (IC) device having a first substrate, an alignment via defined in the first substrate, a first wiring layer over the alignment via, and a first bonding layer over the first wiring layer; forming a second IC device having a second substrate, a second wiring layer over the second substrate, and a second bonding layer over the second wiring layer; bonding the first bonding layer of first IC device to the second bonding layer of second IC device; thinning a backside of the first IC device so as to expose the alignment via; and using the exposed alignment via to form a deep, through substrate via (TSV) that passes through the first IC device, through a bonding interface between the first IC device and second IC device, and landing on the second wiring layer of the second IC device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method, comprising:
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forming an alignment via within a first integrated circuit (IC) device; forming a 3D, bonded IC device by bonding the first IC device to a second IC device so as to define a first bonding interface therebetween; thinning the 3D bonded IC device so as to expose the alignment via; using the exposed alignment via to form a first set of vias that pass through the first IC device, through the first bonding interface and into the second IC device, and land on conductive pads located within the second IC device; and forming a second set of vias within the first IC device that land on conductive pads located within the first IC device, and that do not pass through the first bonding interface. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification