Internal electrical contact for enclosed MEMS devices
First Claim
1. A MEMS device comprising:
- a MEMS substrate, the MEMS substrate includes a first semiconductor layer, a second semiconductor layer and a dielectric layer in between;
wherein MEMS structures are formed from the second semiconductor layer and includes a plurality of first conductive pads;
a base substrate which includes a plurality of second conductive pads thereon;
wherein the second conductive pads are connected to the first conductive pads; and
a conductive connector formed through the dielectric layer of the MEMS substrate to provide electrical coupling between the first semiconductor layer and the second semiconductor layer, whereby the base substrate is electrically connected to the second semiconductor layer and the first semiconductor layer.
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Abstract
A MEMS device is disclosed. The MEMS device comprises a MEMS substrate. The MEMS substrate includes a first semiconductor layer connected to a second semiconductor layer with a dielectric layer in between. MEMS structures are formed from the second semiconductor layer and include a plurality of first conductive pads. The MEMS device further includes a base substrate which includes a plurality of second conductive pads thereon. The second conductive pads are connected to the first conductive pads. Finally, the MEMS device includes a conductive connector formed through the dielectric layer of the MEMS substrate to provide electrical coupling between the first semiconductor layer and the second semiconductor layer. The base substrate is electrically connected to the second semiconductor layer and the first semiconductor layer.
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Citations
18 Claims
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1. A MEMS device comprising:
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a MEMS substrate, the MEMS substrate includes a first semiconductor layer, a second semiconductor layer and a dielectric layer in between;
wherein MEMS structures are formed from the second semiconductor layer and includes a plurality of first conductive pads;a base substrate which includes a plurality of second conductive pads thereon;
wherein the second conductive pads are connected to the first conductive pads; anda conductive connector formed through the dielectric layer of the MEMS substrate to provide electrical coupling between the first semiconductor layer and the second semiconductor layer, whereby the base substrate is electrically connected to the second semiconductor layer and the first semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification