Wafer level packaging
First Claim
1. A die comprising:
- an insulator on an active area of a substrate;
a first bond pad on the insulator and electrically connected to the active area;
a first contact; and
a first trace connecting the first bond pad to the first contact, at least a portion of the first trace disposed on top of the insulator over a portion of the active area.
7 Assignments
0 Petitions
Accused Products
Abstract
Through vias in a substrate are formed by creating a trench in a top side of the substrate and at least one trench in the back side of the substrate. The sum of the depths of the trenches at least equals the height of the substrate. The trenches cross at intersections, which accordingly form the through vias from the top side to the back side. The through vias are filled with a conductor to form contacts on both sides and the edge of the substrate. Contacts on the backside are formed at each of the trench. The through vias from the edge contacts. Traces connect bond pads to the conductor in the through via. Some traces are parallel to the back side traces. Some traces are skew to the back side traces. The substrate is diced to form individual die.
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Citations
20 Claims
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1. A die comprising:
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an insulator on an active area of a substrate; a first bond pad on the insulator and electrically connected to the active area; a first contact; and a first trace connecting the first bond pad to the first contact, at least a portion of the first trace disposed on top of the insulator over a portion of the active area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A die comprising:
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an active area on a substrate having a first edge; a first recess in the first edge; a first contact in the first recess; a first bond pad on the substrate and electrically connected to the active area; and a first trace connecting the first bond pad to the first contact, wherein the first recess extends from a first side of the substrate to a second side of the substrate opposing the first side, so that the electrical connection from the first bond pad to the active area can be made from either the first side or the second side of the substrate. - View Dependent Claims (10, 11, 12)
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13. A die comprising:
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a plurality of bond pads on a first side of a substrate; and a plurality of pairs of contacts on the first side of the substrate, at least some of the plurality of pairs of contacts substantially linearly aligned on a plane of the first side of the substrate, wherein a first bond pad of the plurality of bond pads is substantially linearly aligned with and between centers of a first contact and a second contact of a pair of the plurality of pairs of contacts, and wherein each contact of the plurality of pairs of contacts includes a conductor formed in a through via that is formed in the substrate. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification