Wafer chuck for EUV lithography
First Claim
Patent Images
1. A wafer chuck comprising:
- a substrate andapplied to the substrate, an electrically conductive coating for fixing a wafer by electrostatic attraction, wherein;
the electrically conductive coating comprises at least a first layer under compressive stress, and at least a second layer under tensile stress compensating for the compressive stress of the first layer, andthe electrically conductive coating has a total thickness of less than 300 nm.
1 Assignment
0 Petitions
Accused Products
Abstract
A wafer chuck (1b) having a substrate (2) and having, applied to the substrate (2), an electrically conductive coating (8) for fixing a wafer (6) by electrostatic attraction and preferably having a reflective coating (10) applied to the substrate (2). The coating (8; 10) has at least a first layer (3; 11) under compressive stress and at least a second layer (7; 12) under tensile stress for compensating for the compressive stress of the first layer (3; 11) in order to keep deformation of the wafer chuck (1b) by the coating (8, 10) as low as possible.
-
Citations
28 Claims
-
1. A wafer chuck comprising:
-
a substrate and applied to the substrate, an electrically conductive coating for fixing a wafer by electrostatic attraction, wherein; the electrically conductive coating comprises at least a first layer under compressive stress, and at least a second layer under tensile stress compensating for the compressive stress of the first layer, and the electrically conductive coating has a total thickness of less than 300 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
-
Specification