Semiconductor power module, inverter/converter including the same, and method of manufacturing a cooling jacket for semiconductor power module
First Claim
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1. A semiconductor power module comprising:
- a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket,a heatsink, which is in contact with a refrigerant in the cooling jacket to release heat generated from a plurality of power semiconductor elements,an AC terminal, wherein the DC terminal and the AC terminal protrude from a semiconductor power module body, and the heatsink is arranged on that side of the semiconductor power module body, on which the semiconductor power module is combined with the cooling jacket, wherein the DC terminal is provided on one side of an outer periphery of the semiconductor module, and the AC terminal is provided on an opposite side to the DC terminal,laminated flat plates provided between the DC terminal and the AC terminal, anda low-voltage electrode provided on a separate side from the sides on which the DC terminal and the AC terminal are provided, wherein a conducting plate having a curvature is provided in a position, at which the DC terminal and the laminated flat plates are in contact with each other.
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Accused Products
Abstract
In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.
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Citations
14 Claims
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1. A semiconductor power module comprising:
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a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket, a heatsink, which is in contact with a refrigerant in the cooling jacket to release heat generated from a plurality of power semiconductor elements, an AC terminal, wherein the DC terminal and the AC terminal protrude from a semiconductor power module body, and the heatsink is arranged on that side of the semiconductor power module body, on which the semiconductor power module is combined with the cooling jacket, wherein the DC terminal is provided on one side of an outer periphery of the semiconductor module, and the AC terminal is provided on an opposite side to the DC terminal, laminated flat plates provided between the DC terminal and the AC terminal, and a low-voltage electrode provided on a separate side from the sides on which the DC terminal and the AC terminal are provided, wherein a conducting plate having a curvature is provided in a position, at which the DC terminal and the laminated flat plates are in contact with each other. - View Dependent Claims (2, 3, 6)
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4. A semiconductor power module comprising:
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a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket, a heatsink, which is in contact with a refrigerant in the cooling jacket to release heat generated from a plurality of power semiconductor elements, and an AC terminal, wherein the DC terminal and the AC terminal protrude from a semiconductor power module body, and the heatsink is arranged on that side of the semiconductor power module body, on which the semiconductor power module is combined with the cooling jacket, wherein a gap is present between the heatsink and the cooling jacket, and wherein fins are provided on a side of the heatsink toward the cooling jacket, and the gap is between tip ends of the fins and the cooling jacket and is at least 0.1 mm but at most 2.0 mm.
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5. A semiconductor power module comprising:
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a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket, a heatsink, which is in contact with a refrigerant in the cooling jacket to release heat generated from a plurality of power semiconductor elements, and an AC terminal, wherein the DC terminal and the AC terminal protrude from a semiconductor power module body, and the heatsink is arranged on that side of the semiconductor power module body, on which the semiconductor power module is combined with the cooling jacket, wherein a gap is present between the heatsink and the cooling jacket, and wherein a gap between a base surface of the heatsink and the cooling jacket is at least 0.5 mm.
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7. An inverter/converter comprising:
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a semiconductor power module having a DC terminal to be connected to a condenser module, and to be used in combination with a cooling jacket for cooling, wherein the DC terminal protrudes toward the condenser module beyond the cooling jacket and the condenser module is connected to the semiconductor power module by the DC terminal, and wherein the heatsink comprises a base formed with fins, a housing wall of the inverter/converter is provided with the cooling jacket, the semiconductor power module comprises an insulated substrate on which a plurality of power semiconductor elements are mounted, the insulated substrate and the heatsink being bonded to an opposite surface to a surface of the base of the heatsink formed with the fins, the fins are mounted to the housing wall in a manner to be immerged in an opening of the cooling jacket, and the condenser module and the semiconductor power module are arranged on substantially the same plane, the condenser module being arranged adjacent to the semiconductor power module. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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Specification