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Combining X-ray and VUV analysis of thin film layers

  • US 8,565,379 B2
  • Filed: 03/14/2012
  • Issued: 10/22/2013
  • Est. Priority Date: 03/14/2011
  • Status: Active Grant
First Claim
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1. Apparatus for inspection of a sample, comprising:

  • an X-ray source, which is configured to irradiate a location on the sample, which includes one or more thin film layers, with a beam of X-rays;

    an X-ray detector, which is configured to receive the X-rays that are scattered from the sample and to output a first signal indicative of the received X-rays;

    a VUV source, which is configured to irradiate the location on the sample with a beam of VUV radiation;

    a VUV detector, which is configured to receive the VUV radiation that is reflected from the sample and to output a second signal indicative of the received VUV radiation; and

    a processor, which is configured to process the first signal in order to extract a thickness parameter with respect to one or more of the layers, and to apply the thickness parameter in processing to the second signal in order to derive a characteristic of at least one of the layers.

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