Single shot molding method for COB USB/EUSB devices with contact pad ribs

• US 8,567,050 B2
• Filed: 10/14/2011
• Issued: 10/29/2013
• Est. Priority Date: 12/02/2003
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Technology, Corporation
• Inventors: Hiew, Siew S., Ma, Abraham C., Nan, Nan
• Primary Examiner(s): Cazan, Livius R
• Assistant Examiner(s): PARVEZ, AZM A
• Application Number:
  US13/274,188
• Publication Number:
  US 20120030943A1
• Time in Patent Office: 746 Days
• Field of Search: 298/29, 298/46, 298/48, 298/49, 427 961- 965, 439/55, 439/607, 439/374, 439/79, 439/379, 439/610, 439/680, 361/737, 361/715, 361/727
• US Class Current: 29/840
• CPC Class Codes: G06F 1/1632 External expansion units, e.g. docking stations
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01R 12/57 surface mounting terminals
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0311 Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 5/0278 : of USB type details relating to connectors H01R27/00
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/4916 : Simultaneous circuit manufacturing
• CPC Class Codes: Y10T 29/53209 : Terminal or connector

Abstract

A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Claims

1. A method for producing an Extended-Universal-Serial-Bus (EUSB) device on a printed circuit board (PCB) including opposing first and second surfaces and defining a plurality of openings that extend between the first and second surfaces, a plurality of metal contact pads disposed on the first surface, a plurality of first contact pads disposed on at least one of the first and second surfaces, and a plurality of second contact pads disposed on at least one of the first and second surfaces, wherein the method comprises:

attaching at least one integrated circuit (IC) die to the first contact pads and at least one passive component to the second contact pads;

mounting a plurality of contact springs onto the PCB such that each contact spring extends through a corresponding opening of said plurality of openings, and such that a contact portion of each contact spring protrudes above the first surface of said PCB;

forming a single-shot molded housing on both of the first surface and the second surface of the PCB such that a first housing portion is formed on said first surface and a second housing portion is formed on said second surface, the first housing portion being formed such that the formation of molding material on the plurality of metal contact pads and the plurality of contact springs is prevented, whereby each metal contact pad of said plurality of metal contact pads and each contact spring of the plurality of contact springs is exposed through openings in said first housing portion.

2. The method of claim 1, wherein mounting said plurality of contact springs comprises attaching base portions of each of said plurality of contact springs to a substrate, and then mounting said substrate onto the second surface of the PCB such that said contact portions protrude above the first surface, and such that the substrate covers the plurality of openings.

3. The method of claim 2, wherein forming the single-shot molded housing further comprises disposing a protrusion over the plurality of openings such that molding material is prevented from forming on said plurality of contact springs.

4. The method of claim 1, wherein forming the single-shot molded housing further comprises disposing a protrusion over each of the plurality of metal contact pads such that molding material is prevented from forming on said plurality of metal contact pads.

5. The method of claim 1, wherein attaching said at least one passive component comprises:

printing a solder paste on said second contact pads;

mounting said at least one component on said second contact pads; and

reflowing the solder paste such that said at least one component is fixedly soldered to said second contact pads.

6. The method of claim 1, further comprising grinding a wafer including said at least one IC die such that a thickness of said wafer is reduced during said grinding, and then dicing said wafer to provide said at least one IC die.

7. The method of claim 6, wherein attaching at least one IC die comprises bonding said at least one IC die to the second surface of the PCB and wire bonding the at least one IC die to said first contact pads.

8. The method of claim 1,

wherein producing the PCB comprises forming a PCB panel including at least ten of said PCBs arranged in two rows, and

wherein the method further comprises singulating said PCB panel after forming said single-shot molded housing such that the molded housing includes a peripheral wall extending perpendicular to the PCB, and such that the peripheral wall is aligned with a peripheral edge of the PCB.