Cutting elements, methods for manufacturing such cutting elements, and tools incorporating such cutting elements

• US 8,567,531 B2
• Filed: 05/20/2010
• Issued: 10/29/2013
• Est. Priority Date: 05/20/2009
• Status: Active Grant

• Current Assignee: Smith International Incorporated (SLB)
• Original Assignee: Smith International Incorporated (SLB)
• Inventors: Belnap, J. Daniel, Voronin, Georgiy, Yu, Feng, Cariveau, Peter T., Zhang, Youhe, Shen, Yuelin, Zhan, Guodong
• Primary Examiner(s): HUTCHINS, CATHLEEN R
• Application Number:
  US12/784,460
• Publication Number:
  US 20100294571A1
• Time in Patent Office: 1,258 Days
• Field of Search: 175/420.2, 175/425, 175/432, 175/433, 175/434
• US Class Current: 175/420.2
• CPC Class Codes: B01J 2203/062 Diamond
• CPC Class Codes: B01J 2203/0655 Diamond
• CPC Class Codes: B01J 2203/0685 Crystal sintering
• CPC Class Codes: B01J 3/062 characterised by the composition of the materials to be processed
• CPC Class Codes: B22F 2003/244 Leaching
• CPC Class Codes: B22F 2005/001 Cutting tools, earth boring or grinding tool other than table ware
• CPC Class Codes: B22F 2207/01 Composition gradients
• CPC Class Codes: B22F 2207/13 Size gradients
• CPC Class Codes: B22F 2207/17 density or porosity gradients
• CPC Class Codes: B22F 2998/10 Processes characterised by the sequence of their steps
• CPC Class Codes: B22F 2999/00 Aspects linked to processes or compositions used in powder metallurgy
• CPC Class Codes: B22F 3/14 simultaneously
• CPC Class Codes: B22F 7/062 involving the connection or repairing of preformed parts
• CPC Class Codes: B24D 3/10 for porous or cellular structure, e.g. for use with diamonds as abrasives
• CPC Class Codes: C22C 2026/006 with additional metal compounds being carbides
• CPC Class Codes: C22C 26/00 Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
• CPC Class Codes: E21B 10/55 with preformed cutting elements
• CPC Class Codes: E21B 10/567 with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts
• CPC Class Codes: E21B 10/5735 Interface between the substrate and the cutting element

Abstract

The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having a high diamond content which are configured to provide improved properties of thermal stability and wear resistance, while maintaining a desired degree of impact resistance, when compared to prior polycrystalline diamond bodies. In various embodiments disclosed herein, a cutting element with high diamond content includes a modified PCD structure and/or a modified interface (between the PCD body and a substrate), to provide superior performance.

Claims

1. A cutting element comprising:

a polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond grains and interstitial regions between the diamond grains;

wherein a first region of the microstructure proximate the cutting edge comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the first region extends from the cutting edge to a depth of at least 300 microns,

wherein a second region of the microstructure proximate the interface surface comprises a plurality of the interstitial regions comprising the catalyst material disposed therewithin,

wherein the first region comprises a diamond average grain size less than 25 microns, and

wherein the first region has at least one of the following properties;

an apparent porosity less than (0.1051)·

(the diamond average grain size ^−

0.3737), or

a leached weight loss less than (0.251)·

(the diamond average grain size ^−

0.2691), or

a diamond volume fraction greater than (0.9077)·

(the diamond average grain size ^0.0221),

with the diamond average grain size provided in microns.

2. The cutting element of claim 1, wherein the apparent porosity in the first region is less than (0.1051)·

(the average grain size ^−

0.3737).

3. The cutting element of claim 1, wherein the leached weight loss in the first region is less than (0.251)·

(the average grain size ^−

0.2691).

4. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than (0.9077)·

(the average grain size ^ 0.0221).

5. The cutting element of claim 1, wherein the polycrystalline diamond body requires at least 3 days at a standard leaching condition to form the first region.

6. The cutting element of claim 1, wherein the polycrystalline diamond body requires at least 4 days at a standard leaching condition to form the first region.

7. The cutting element of claim 1, wherein the polycrystalline diamond body requires at least 8 days at a standard leaching condition to form the first region.

8. The cutting element of claim 1, wherein the first region extends from the cutting edge to a depth of at least 400 microns.

9. The cutting element of claim 1, wherein the first region extends from the cutting edge to a depth of at least 500 microns.

10. The cutting element of claim 1, wherein the first region has at least one of the following properties:

the apparent porosity is less than (0.091)·

(the average grain size ^−

0.3471), or

the leached weight loss is less than (0.2328)·

(the average grain size ^−

0.2653), or

the diamond volume fraction is greater than (0.9187)·

(the average grain size ^ 0.0183).

11. The cutting element of claim 1, wherein the first region has at least one of the following properties:

the apparent porosity is less than (0.0744)·

(the average grain size ^−

0.2932), or

the leached weight loss is less than (0.2052)·

(the average grain size ^−

0.2455), or

the diamond volume fraction is greater than (0.9291)·

(the average grain size ^ 0.0148).

12. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than 91% and the average grain size in the first region is less than 3 microns.

13. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than 93% and the average grain size in the first region is less than 8 microns.

14. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than 94% and the average grain size in the first region is less than 13 microns.

15. The cutting element of claim 1, wherein the second region comprises a diamond volume fraction that is less than the diamond volume fraction of the first region.

16. The cutting element of claim 1, wherein the first region extends along an entire perimeter of the cutting element.

17. The cutting element of claim 1, wherein the first region extends along a portion of the top surface of the polycrystalline diamond body.

18. The cutting element of claim 1, wherein the first region extends along at least a critical zone of the polycrystalline diamond body.

19. The cutting element of claim 1, wherein the first region extends along the entire top surface, the cutting edge, and at least a portion of a side surface.

20. The cutting element of claim 19, wherein the depth of the first region along the top surface, the cutting edge, and the side surface extends to at least 300 microns within the diamond body.

21. The cutting element of claim 1, wherein the second region comprises a larger average grain size than that of the first region.

22. The cutting element of claim 1, wherein the interstitial regions in the second region have a larger size than those in the first region.

23. The cutting element of claim 1, further comprising a substrate bonded to the second region, and an interface between the substrate and the second region.

24. The cutting element of claim 23, wherein the substrate comprises a cobalt content within the range of approximately 6 to 11% by weight.

25. The cutting element of claim 23, wherein the interface comprises a dome having a height to diameter ratio of less than approximately 0.1.

26. The cutting element of claim 23, wherein the interface comprises a protrusion having a protrusion ratio between 0.5 and 1.0.

27. The cutting element of claim 23, wherein the interface comprises a protrusion having a protrusion ratio less than 0.4.

28. The cutting element of claim 23, wherein the interface comprises a smooth surface devoid of protrusions and depressions.

29. The cutting element of claim 1, wherein the polycrystalline diamond body further comprises a third region between the first and second regions, the third region having a lower catalyst content than that of the second region.

30. The cutting element of claim 1, wherein a property of the material microstructure varies along a gradient within the diamond body.

31. The cutting element of claim 1, wherein the polycrystalline diamond body has a dry vertical turret lathe (VTL) cutting distance of at least 5500 feet prior to formation of the first region having the interstitial regions that are substantially free of the catalyst material.

32. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 1 disposed thereon.

33. The downhole tool of claim 32, wherein the downhole tool comprises a drill bit.

34. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than (0.9187)·

(the average grain size ^ 0.0183).

35. The cutting element of claim 1, wherein the diamond volume fraction in the first region is greater than (0.9291)·

(the average grain size ^ 0.0148).

36. The cutting element of claim 1, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

37. A cutting element comprising:

a polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond grains and interstitial regions between the diamond grains;

wherein a first layer of the microstructure proximate the cutting edge comprises a first diamond volume fraction,

wherein a second layer of the microstructure proximate the interface surface comprises a second diamond volume fraction that is at least approximately 2% less than the first diamond volume fraction, and

wherein the first layer has at least one of the following properties;

an apparent porosity less than (0.1051)·

(the diamond average grain size ^ 0.3737), or

a leached weight loss less than (0.251)·

(the diamond average grain size ^ 0.2691), or

the first diamond volume fraction is greater than (0.9077)·

(the diamond average grain size ^ 0.0221),

with the diamond average grain size provided in microns.

38. The cutting element of claim 37, wherein the first layer comprises an average grain size less than 25 microns.

39. The cutting element of claim 37, wherein the first layer has a first grain size distribution and the second layer has a second grain size distribution which is different from the first grain size distribution of the first layer.

40. The cutting element of claim 37, wherein a first region of the polycrystalline diamond body extending from the cutting edge comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein a second region proximate the interface comprises a plurality of the interstitial regions comprising the catalyst material disposed therewithin.

41. The cutting element of claim 40, wherein the first region extends partially through the first layer.

42. The cutting element of claim 40, wherein at least a portion of the first region extends through the first layer and into the second layer.

43. The cutting element of claim 40, wherein the first region extends to a depth of no more than 100 microns.

44. The cutting element of claim 40, wherein the first region extends to a depth within a range of 100 to less than 300 microns.

45. The cutting element of claim 40, wherein the first region extends to a depth of at least 300 microns.

46. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 37 disposed thereon.

47. The cutting element of claim 37, wherein the diamond volume fraction in the first region is greater than (0.9187)·

(the average grain size ^ 0.0183).

48. The cutting element of claim 37, wherein the diamond volume fraction in the first region is greater than (0.9291)·

(the average grain size ^ 0.0148).

49. The cutting element of claim 37, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

50. A cutting element comprising:

a polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond grains and interstitial regions between the diamond grains;

wherein a first region of the microstructure proximate the cutting edge comprises a plurality of the interstitial regions that are substantially free of a catalyst material,

wherein the interface surface comprises a protrusion ratio of less than 0.7,

wherein the first region comprises a diamond average grain size less than 25 microns, and

wherein the first region has at least one of the following properties;

an apparent porosity less than (0.1051)·

(the diamond average grain size ^ 0.3737), or

a leached weight loss less than (0.251)·

(the diamond average grain size ^ 0.2691), or

a diamond volume fraction greater than (0.9077)·

(the diamond average grain size ^0.0221),

with the diamond average grain size provided in microns.

51. The cutting element of claim 50, wherein the first region extends to a depth of no more than 100 microns.

52. The cutting element of claim 50, wherein the first region extends to a depth within a range of 100 to less than 300 microns.

53. The cutting element of claim 50, wherein the first region extends to a depth of at least 300 microns.

54. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 50 disposed thereon.

55. The cutting element of claim 50, wherein the diamond volume fraction in the first region is greater than (0.9187)·

(the average grain size ^ 0.0183).

56. The cutting element of claim 50, wherein the diamond volume fraction in the first region is greater than (0.9291)·

(the average grain size ^ 0.0148).

57. The cutting element of claim 50, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

58. A cutting element comprising:

a substrate having an interface surface, wherein the substrate comprises a cobalt content less than approximately 11% by weight; and

a polycrystalline diamond body formed over the interface surface of the substrate, the polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond grains and interstitial regions between the diamond grains, and

wherein a portion of the polycrystalline diamond body has at least one of the following properties;

an apparent porosity less than (0.1051)·

(the diamond average grain size ^−

0.3737), or

a leached weight loss less than (0.251)·

(the diamond average grain size ^ 0.2691), or

a diamond volume fraction greater than (0.9077)·

(the diamond average grain size ^ 0.0221),

with the diamond average grain size provided in microns.

59. The cutting element of claim 58, wherein at least a portion of the polycrystalline diamond body comprises a an average grain size less than 25 microns.

60. The cutting element of claim 58, wherein the substrate comprises a cobalt content within the range of approximately 9 to 11% by weight.

61. The cutting element of claim 58, wherein the material microstructure comprises a first region extending from the cutting edge and comprising a plurality of the interstitial regions that are substantially free of a catalyst material, and comprises a second region proximate the interface surface comprising a plurality of the interstitial regions comprising the catalyst material disposed therewithin.

62. The cutting element of claim 61, wherein the first region extends to a depth of no more than 100 microns.

63. The cutting element of claim 61, wherein the first region extends to a depth within a range of 100 to less than 300 microns.

64. The cutting element of claim 61, wherein the first region extends to a depth of at least 300 microns.

65. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 58 disposed thereon.

66. The cutting element of claim 58, wherein the diamond volume fraction in the first region is greater than (0.9187)·

(the average grain size ^ 0.0183).

67. The cutting element of claim 58, wherein the diamond volume fraction in the first region is greater than (0.9291)·

(the average grain size ^ 0.0148).

68. The cutting element of claim 58, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

69. A cutting element comprising:

a polycrystalline diamond body sintered at a sintering cold cell pressure greater than 5.4 GPa, the polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond grains and interstitial regions between the diamond grains;

wherein a first region of the microstructure proximate the cutting edge comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the first region extends from the cutting edge to a depth of at least 300 microns,

wherein a second region of the microstructure proximate the interface surface comprises a plurality of the interstitial regions comprising the catalyst material disposed therewithin,

wherein the first region comprises a diamond average grain size less than 25 microns, and

wherein the first region comprises a diamond volume fraction greater than 92%.

70. The cutting element of claim 69, wherein the first region comprises an average grain size of at most 15 microns and a diamond volume fraction greater than 92.5%.

71. The cutting element of claim 69, wherein the first region comprises an average grain size in the range of from 2.5 to 12 microns and a diamond volume fraction greater than 92.5%.

72. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 69 disposed thereon.

73. The cutting element of claim 69, wherein the diamond volume fraction in the first region is greater than 95%.

74. The cutting element of claim 73, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

75. The cutting element of claim 69, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

76. A cutting element comprising:

a polycrystalline diamond body comprising;

an interface surface;

a top surface opposite the interface surface;

a cutting edge meeting the top surface; and

a material microstructure comprising a plurality of bonded-together diamond crystals and interstitial regions between the diamond crystals;

wherein a first region of the microstructure proximate the cutting edge comprises a plurality of the interstitial regions that are substantially free of a catalyst material, and wherein the first region extends from the cutting edge to a depth of at least 300 microns,

wherein a second region of the microstructure proximate the interface surface comprises a plurality of the interstitial regions comprising the catalyst material disposed therewithin, and

wherein the first region satisfies one of the following conditions;

an average grain size within the range of 2-4 microns, and a diamond volume fraction greater than 93%, or

an average grain size within the range of 4-6 microns, and a diamond volume fraction greater than 94%, or

an average grain size within the range of 6-8 microns, and a diamond volume fraction greater than 95%, or

an average grain size within the range of 8-10 microns, and a diamond volume fraction greater than 95.5%, or

an average grain size within the range of 10-12 microns, and a diamond volume fraction greater than 96%.

77. A downhole tool comprising a tool body and at least one cutting element as claimed in claim 76 disposed thereon.

78. The cutting element of claim 76, wherein the diamond volume fraction in the first region is greater than 95%.

79. The cutting element of claim 78, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.

80. The cutting element of claim 76, wherein the polycrystalline diamond body is formed by sintering at a cold cell pressure greater than 6.5 GPa.