Efficient LED array

• US 8,567,988 B2
• Filed: 09/29/2008
• Issued: 10/29/2013
• Est. Priority Date: 09/29/2008
• Status: Active Grant

• Current Assignee: BX LED LLC (IPValuation Partners, LLC)
• Original Assignee: Bridgelux Incorporated
• Inventors: Helbing, Rene Peter
• Primary Examiner(s): Husar, Stephen F
• Assistant Examiner(s): CRANSON JR, JAMES W
• Application Number:
  US12/240,011
• Publication Number:
  US 20100079990A1
• Time in Patent Office: 1,856 Days
• Field of Search: 257/98, 257/88, 257/99, 362/249.02, 362/218, 362/294, 362/247, 362/296.04
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21S 6/00 Lighting devices intended to be free-standing F21S9/00, F21S10/00, F21S13/12 take precedence lighting devices specially adapted to be transported from place to place, e.g. lighting devices carried on wheeled supports F21L; details of supports for lighting devices F21V21/00
• CPC Class Codes: F21S 8/08 with a standard F21S6/00 takes precedence
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.

Claims

1. A light emitting diode (LED) apparatus comprising:

a metal substrate having a reflective surface; and

a plurality of LED chips mounted directly to the reflective surface of the metal substrate creating an efficient thermal path and at least a portion of the LED chips being spaced apart from each other to expose regions of the reflective surface between the portion of the LED chips, the exposed regions reflecting light emitted from the portion of the LED chips, and

an electrical path formed by connecting the LED chips in a chip to chip fashion.

2. The apparatus of claim 1, wherein the reflective surface comprises polished aluminum.

3. The apparatus of claim 1, wherein the reflective surface comprises silver plating.

4. The apparatus of claim 1, wherein the reflective surface has a reflectivity of 70% or greater.

5. The apparatus of claim 1, wherein the at least a portion of the LED chips form an array having a chip spacing that is approximately 0.5 millimeters or greater.

6. The apparatus of claim 1, wherein the plurality of LED chips provide separate thermal and electrical paths.

7. The apparatus of claim 1 wherein the plurality of LED chips have a first surface that is mounted to the reflective surface, and electrical contacts that are provided on one or more surfaces that are not the first surface.

8. The apparatus of claim 1, wherein the metal substrate is mounted directly to a heat sink.

9. The apparatus of claim 1, wherein the electrical path formed by connecting the LED chips in a chip to chip fashion does not include an electrical connection between the LED chips and the reflective surface.