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Flood exposure process for dual tone development in lithographic applications

  • US 8,568,964 B2
  • Filed: 04/27/2009
  • Issued: 10/29/2013
  • Est. Priority Date: 04/27/2009
  • Status: Active Grant
First Claim
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1. A method of patterning a substrate, comprising:

  • forming a layer of radiation-sensitive material on a substrate;

    performing a patterned exposure of said layer of radiation-sensitive material using a mask having a mask critical dimension to form first radiation-sensitive material portions having a high radiation exposure, second radiation-sensitive material portions having a low radiation exposure, and third radiation-sensitive material portions having an intermediate radiation exposure;

    performing a first post-exposure bake following said performing said patterned exposure;

    performing positive-tone developing of said layer of radiation-sensitive material to remove said first radiation-sensitive material portions from said substrate;

    performing a flood exposure of said layer of radiation-sensitive material;

    performing a second post-exposure bake following said performing said flood exposure; and

    performing negative-tone developing of said layer of radiation-sensitive material to remove said second radiation-sensitive material portions from said substrate,wherein said third radiation-sensitive material portions remain after performing said positive-tone and negative-tone developing.

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