Wafer level structures and methods for fabricating and packaging MEMS
First Claim
1. A method comprising:
- forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities;
forming an actuator/sensor layer including a number of Micro-Electromechanical System (MEMS) devices with electrically conductive regions therein;
bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a hermetically sealed cavity around the MEMS; and
electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect.
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Abstract
Methods of fabricating a Micro-Electromechanical System (MEMS) in a hermetically sealed cavity formed at a substrate level are provided. Generally, the method comprises: (i) forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; (ii) forming an actuator/sensor layer including a number of MEMS devices with electrically conductive regions therein; (iii) bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a sealed cavity around the MEMS; and (iv) electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. Other embodiments are also described.
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Citations
22 Claims
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1. A method comprising:
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forming a number of first open cavities in a surface of a first substrate and a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; forming an actuator/sensor layer including a number of Micro-Electromechanical System (MEMS) devices with electrically conductive regions therein; bonding the first substrate and the second substrate to the actuator/sensor layer so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices to form a hermetically sealed cavity around the MEMS; and electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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forming a number of Micro-Electromechanical System (MEMS) devices including electrically conductive regions therein on a surface of a first substrate; forming a number of first open cavities in the surface of the first substrate underlying the number of MEMS devices; forming a number of second open cavities in a surface of a second substrate corresponding to the first open cavities; and aligning the first substrate to the second substrate so that at least one of the number of the first and second open cavities align with at least one of the number of MEMS devices; hermetically sealing the cavity around the MEMS device by bonding the first substrate to the second substrate; and electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect. - View Dependent Claims (13, 14, 15, 16)
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17. A method comprising:
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etching a number of first open cavities in a surface of a first substrate to form a top cap (TCAP); forming an actuator/sensor layer including a number of Micro-Electromechanical System (MEMS) devices with electrically conductive regions therein; bonding the first substrate to the actuator/sensor layer so that at least one of the number of the first open cavities aligns with at least one of the number of MEMS devices; etching a number of second open cavities in a surface of a second substrate corresponding to the first open cavities to form a bottom cap (BCAP); bonding the second substrate to the actuator/sensor layer so that at least one of the number of the second open cavities align with at least one of the number of MEMS devices and at least one of the first open cavities to form a sealed cavity around the MEMS device; and electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity through an electrical interconnect, wherein at least one of the first or second substrates further includes a complementary metal oxide semiconductor (CMOS) integrated circuit (IC), and wherein electrically connecting the electrically conductive regions of the MEMS device to a pad outside of the sealed cavity comprises electrically connecting the electrically conductive regions of the MEMS device through the CMOS IC. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification