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Sensor and method for fabricating the same

  • US 8,569,851 B2
  • Filed: 06/18/2010
  • Issued: 10/29/2013
  • Est. Priority Date: 06/18/2010
  • Status: Expired due to Fees
First Claim
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1. A sensor for measuring environmental forces, said sensor comprising:

  • a vent cavity in a substrate wafer extending from an opening in the top surface of said substrate wafer and continuing along a channel to an outlet in an exterior surface of said substrate wafer, the channel having a depth extending into the top surface of the substrate wafer;

    a first device layer, wherein the bottom surface of said first device layer is bonded to said top surface of said substrate wafer, and wherein a portion of the bottom surface of said first device layer and a portion of said top surface of said substrate wafer are spaced apart by the channel;

    a diaphragm cavity extending through said first device layer to said vent cavity;

    a second device layer, wherein the bottom surface of said second device layer is bonded to the top surface of said first device layer to form a diaphragm over said diaphragm cavity, wherein a top surface of the diaphragm is in direct contact with an environment exterior to the sensor, and a bottom surface of the diaphragm is in direct contact with the environment exterior to the sensor via the diaphragm cavity and the vent cavity; and

    a sensing element in said second device layer, the sensing element located proximate to said diaphragm to sense. flexure in said diaphragm.

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