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Silicon microphone package

  • US 8,571,249 B2
  • Filed: 05/25/2010
  • Issued: 10/29/2013
  • Est. Priority Date: 05/29/2009
  • Status: Active Grant
First Claim
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1. A silicon microphone package, comprising:

  • an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element;

    a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; and

    a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.

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