Silicon microphone package
First Claim
Patent Images
1. A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element;
a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; and
a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.
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Abstract
A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
40 Citations
25 Claims
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1. A silicon microphone package, comprising:
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an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; and a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A silicon microphone package, comprising:
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an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; an acoustic opening formed in a portion of the first cover member, partially exposing the integrated microphone die; and a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die, and wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A silicon microphone package, comprising:
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an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die; and an acoustic opening formed in a portion of the second cover member, partially exposing the integrated microphone die, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25)
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Specification