Disassembling an item by means of RF energy

• US 8,572,831 B2
• Filed: 06/07/2010
• Issued: 11/05/2013
• Est. Priority Date: 06/07/2010
• Status: Expired due to Fees

• Current Assignee: Empire Technology Development LLC (Allied Inventors Management, LLC)
• Original Assignee: Empire Technology Development LLC (Allied Inventors Management, LLC)
• Inventors: Kruglick, Ezekiel, Meloni, Mark
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US12/995,440
• Publication Number:
  US 20120011692A1
• Time in Patent Office: 1,247 Days
• Field of Search: 294/261, 297/00
• US Class Current: 29/426.1
• CPC Class Codes: B23P 19/04 for assembling or disassembling parts
• CPC Class Codes: F16B 17/00 Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformationriveting F16B19/04
• CPC Class Codes: H05B 6/105 using a susceptor
• CPC Class Codes: Y10T 29/49815 Disassembling
• CPC Class Codes: Y10T 29/49822 by applying force
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble
• CPC Class Codes: Y10T 428/24521 with component conforming to contour of nonplanar surface

Abstract

Technologies are generally described for providing inductively removable assembly bonding. Inductive elements may be placed strategically at bonding locations between two or more coupled components. At disassembly time, the elements may be heated through Radio Frequency (RF) energy causing the bonds to break and components to separate. For example, inductive elements placed near plastic stake bonds between dissimilar materials in an electronic device may be employed to separate the dissimilar materials during a recycling process. According to some examples, the elements may also be heated through a directly applied electric current via a network of connections designed into the assembly.

Claims

1. A method for facilitating disassembly of an item that is attached to a component, the method comprising:

wirelessly applying a first Radio Frequency (RF) energy to one or more embedded bosses located in the item to initiate deformation of the one or more embedded bosses located in the item, wherein each of the one or more embedded bosses includes an inductor that is configured to generate heat reactive to the first RF energy such that the embedded bosses are deformed, and wherein the item is attached to the component with the one or more embedded bosses; and

separating the components from the item after the first RF energy initiates deformation of the one or more embedded bosses located in the item.

2. The method according to claim 1, further comprising attaching the components to the item by:

positioning the embedded bosses to fit into holes in the components;

applying a second RF energy to the item such that the embedded bosses

are deformed creating a stake joint between the components, wherein the stake joint is deformable in response to the first RF energy, which is different from the second RF energy.

3. The method according to claim 2, further comprising:

deforming the bosses to form one of;

a flush stake, a dome stake, or an internal stake.

4. The method according to claim 1, further comprising attaching the components to the item by:

positioning the embedded bosses to fit into holes in the components;

deforming the embedded bosses through one or more of;

mechanical

force, direct contact heat deformation, hot air deformation, and/or ultrasonic deformation.

5. The method according to claim 1, further comprising attaching the components to the item by one or more of:

aligning holes in two or more components and inserting a boss to the holes for a tight fit, and

aligning holes in one or more components with a boss integrated into another component and inserting the boss to the holes for a tight fit.

6. The method according to claim 1, further comprising manufacturing the inductor as a coil.

7. The method according to claim 1, further comprising applying the first RF energy by generating an RF field.

8. The method according to claim 7, further comprising adjusting a waveform of the RF field based on one or more characteristics of the inductor and/or the bosses in the assembled item.

9. The method according to claim 7, wherein the one or more characteristics of inductor correspond to one or more of a size, a shape, a thickness, and/or a type of the inductor.

10. The method according to claim 7, wherein the one or more characteristics of the bosses correspond to one or more of a size, a shape, and/or a type of the bosses.

11. The method according to claim 7, further comprising adjusting a waveform of the RF field based on a predefined period, wherein the waveform includes one or more of a pulse waveform, a square-wave waveform, a ramp up waveform, a ramp down waveform, a triangle waveform, and/or a sine-wave waveform.

12. The method according to claim 7, further comprising adjusting a waveform of the RF field based on safety considerations.

13. The method according to claim 7, further comprising generating the RF field from a source that is coupled to the assembled item.

14. The method according to claim 1, further comprising separating the components by either mechanically agitating the item or magnetically separating the item.