Method for manufacturing solar cells

• US 8,574,943 B2
• Filed: 09/10/2008
• Issued: 11/05/2013
• Est. Priority Date: 09/10/2007
• Status: Expired due to Fees

• Current Assignee: Dyesol Industries Pty., Ltd. (Greatcell Solar Ltd.)
• Original Assignee: Dyesol Industries Pty., Ltd. (Greatcell Solar Ltd.)
• Inventors: Murray, Paul, Moonie, Paul, Platts, Renai
• Primary Examiner(s): Rizkallah, Kimberly
• Assistant Examiner(s): HENRY, CALEB E
• Application Number:
  US12/677,384
• Publication Number:
  US 20100206461A1
• Time in Patent Office: 1,882 Days
• Field of Search: 136/263, 136/265, 136/251, 438/57
• US Class Current: 438/57
• CPC Class Codes: H01G 9/2027 comprising an oxide semiconductor electrode
• CPC Class Codes: H01G 9/2077 Sealing arrangements, e.g. to prevent the leakage of the electrolyte
• CPC Class Codes: H01G 9/2095 comprising a flexible sustrate
• CPC Class Codes: Y02E 10/542 Dye sensitized solar cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Methods and materials used to manufacture a series of substantially identical solar cells which then can be assembled into arrays of various designs, as required, to achieve the desired electrical output. The invention is described with reference to producing dye solar cells.

Claims

1. A method for manufacturing at least one solar cell, the method comprising the sequential steps of:

(a) providing at least two substrates;

(b) at least partially forming at least one cell by applying portions of a low melting point gasket material to some regions of a substrate and applying portions of a high melting point gasket material to other regions of a substrate so that the low melting point gasket material defines a first portion of a perimeter of the cell and the high melting point gasket material defines a remaining second portion of the perimeter of the cell;

(c) bringing the two substrates together;

(d) activating the lower melting point gasket material to seal the first portion of the perimeter of the cell such that the lower melting point gasket material seals between the two substrates;

(e) filling the at least one cell defined by the gasket materials with an electrolyte by passing the electrolyte through the unactivated second portion of the perimeter of the cell defined by the high melting point gasket material; and

(f) activating the higher melting point gasket material to seal the second portion of the perimeter of the cell such that the higher melting point gasket material seals between the two substrates.

2. The method according to claim 1, further comprising the step of forming the at least one solar cell to be flexible.

3. The method according to claim 1, further comprising the step of forming the at least one solar cell as a photoelectrochemical cell.

4. The method according to claim 3, further comprising the step of forming the photoelectrochemical cell as a dye solar cell.

5. The method according to claim 1, further comprising the step of the substrates including either a metal foil or a coated metal foil.

6. The method according to claim 1, further comprising the step of the substrates including one a glass, a ceramic or a polymeric material.

7. The method according to claim 4, further including the step of applying a layer of semiconductor wherein the semiconductor of the dye solar cell is selected from the group consisting of titanium dioxide, ZnO, SnO2, niobium oxide or any combination of those materials with or without alkali and alkaline earth oxides, rare earth oxides, and other transition metal oxides or a semiconducting polymer.

8. The method according to claim 7, further comprising the step of depositing the semiconductor in one or more layers on a number of cells simultaneously by a technique selected from screen printing, doctor blading, spray deposition, dipping, tape casting, gravure printing or combination of these or similar technique to achieve a thickness after at least one of a heat and a pressure treatment of between 50 nm and 25 microns.

9. The method according to claim 8, further comprising the step of processing the substrate with deposited semiconductor by at least one of heat and pressure, with an option of deposition of a concurrent or subsequent application of a sol material to produce working electrodes suitable for dye application.

10. The method according to claim 9, further comprising the step of dying the electrodes with one or more dyes to produce a set of interconnected working electrodes.

11. The method according to claim 1, further comprising the step of the gasket materials including either of a polymeric gasket or ormocer gasket.

12. The method according to claim 11, further including the step of applying a catalyst whereby the catalyst may be dispersed as a Pt alloy or a Pt alloy or a mixture, carbon, PEDOT, Ru oxide or a combination thereof.

13. The method according to claim 12, further comprising the step of depositing the catalyst by one or more of screen printing, spraying, doctor blading, dipping, thermal decomposition, CVD, sputtering, PVD, chemical reduction and UV initiated reduction.

14. The method according to claim 1, wherein the steps of activating comprises the step of using a reflow oven to liquidize and subsequently cure on cooling the gasket material.

15. The method according to claim 1, wherein the steps of activating comprises the step of applying non-localized heat by a flat heat press or roller.

16. The method according to claim 1, further comprising the step of using either a redox electrolyte or a hole conductor as the electrolyte.

17. The method according to claim 1, further comprising the step of providing the electrolyte with pigment additives to achieve altered visual coloration.

18. The method according to claim 1, further comprising the step of introducing the electrolyte via an edge aperture.

19. The method according to claim 1, further including the step of depositing busbars onto a counter electrode, prior to cell assembly, by deposition of a heat curable or low temperature conductive ink or low temperature curing solder paste or a combination thereof.

20. The method according to claim 1, further comprising the step of using one of laser scribing or a jet milling cutting technique to separate the substrate.

21. The method according to any claim 1, further comprising the step of forming a plurality of solar cells between the substrates.

22. The method according to claim 21, further including the step of separating at least some of the at least partially formed cells by separating the substrates using a cutting technique.