Post-fabrication self-aligned initialization of integrated devices

• US 8,575,008 B2
• Filed: 08/31/2010
• Issued: 11/05/2013
• Est. Priority Date: 08/31/2010
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: International Business Machines Corporation
• Inventors: Franceschini, Michele M., Karidis, John P.
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US12/873,058
• Publication Number:
  US 20120049144A1
• Time in Patent Office: 1,162 Days
• Field of Search: 438/469, 438/102, 365/163
• US Class Current: 438/469
• CPC Class Codes: H10N 70/021 Formation of switching materials, e.g. deposition of layers
• CPC Class Codes: H10N 70/063 by etching of pre-deposited switching material layers, e.g. lithography
• CPC Class Codes: H10N 70/20 Multistable switching devices, e.g. memristors
• CPC Class Codes: H10N 70/231 based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
• CPC Class Codes: H10N 70/823 adapted for essentially horizontal current flow, e.g. bridge type devices
• CPC Class Codes: H10N 70/826 adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
• CPC Class Codes: H10N 70/828 Current flow limiting means within the switching material region, e.g. constrictions
• CPC Class Codes: H10N 70/8413 adapted for resistive heating
• CPC Class Codes: H10N 70/8828 Tellurides, e.g. GeSbTe

Abstract

Creating a localized region of material having a target chemical composition by defining an electrical circuit on a substrate, and depositing on the electrical circuit one or more layers of materials having one or more chemical compositions. An electrical current pulse is applied to the electrical circuit to create a self-aligned localized region having the target chemical composition. Applying the electrical current pulse causes a portion of the one or more layers of materials to be heated, resulting in the target chemical composition.

Claims

1. A method of creating a localized region of material having a target chemical composition, the method comprising:

defining an electrical circuit on a substrate;

depositing one or more layers of materials having one or more chemical compositions, the depositing on the electrical circuit; and

applying an electrical current pulse to the electrical circuit to create a self-aligned localized region having the target chemical composition, the applying an electrical current pulse causing a portion of the one or more layers of materials to be heated resulting in the target chemical composition;

wherein the one or more layers of materials include a topmost layer that is a chemical resist, and the self-aligned localized region defines a region for sensitizing the chemical resist, the sensitizing occurring in response to an increase in temperature.

2. The method of claim 1, wherein the applying an electrical current pulse causes an electrical current to flow from a first electrode to a second electrode, the electrical current passing through at least one of the layers of material.

3. The method of claim 1, wherein the one or more layers of materials further include at least one layer of amorphous threshold switching material having high electrical resistivity at low electric field strength and substantially reduced electrical resistivity at electric field strengths above a threshold.

4. The method of claim 1, wherein the target chemical composition is a phase change material.

5. The method of claim 4, wherein the phase change material is a germanium-antimony-tellurium materials.

6. The method of claim 1, wherein an extent of the localized region is responsive to a geometry of the electrical circuit and to one or more of a magnitude and a duration of the electrical current pulse.