×

Semiconductor chip with linear expansion coefficients in direction parallel to sides of hexagonal semiconductor substrate and manufacturing method

  • US 8,575,729 B2
  • Filed: 05/13/2011
  • Issued: 11/05/2013
  • Est. Priority Date: 05/18/2010
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor chip on which a power semiconductor device is formed and which comprises a semiconductor substrate made from a hexagonal semiconductor having an anisotropic property in linear expansion coefficient due to a crystal orientation,wherein the semiconductor substrate has a shape of a rectangle on a principal surface,wherein the rectangle is defined by two sides having lengths a and b equal to each other,wherein linear expansion coefficients in directions parallel to the two sides of the semiconductor substrate are equal to each other, andwherein the principal surface of the semiconductor substrate and a (0001) plane or (000-1) plane of the hexagonal semiconductor form an angle θ

  • , which satisfies the following expression


    10°



    θ



    10°

    .

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×