Semiconductor device with increased I/O leadframe including power bars

• US 8,575,742 B1
• Filed: 04/06/2009
• Issued: 11/05/2013
• Est. Priority Date: 04/06/2009
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kim, Wan Jong, Do, Young Tak, Cho, Byong Woo
• Primary Examiner(s): Rizkallah, Kimberly
• Assistant Examiner(s): HENRY, CALEB E
• Application Number:
  US12/419,180
• Time in Patent Office: 1,674 Days
• Field of Search: 257/688, 257/690, 257/691, 257/696, 257/730, 257/670, 257/666
• US Class Current: 257/691
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49433 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A semiconductor device or semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package, and further to provide one or more power bars in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die paddle or die pad defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads include exposed bottom surface portions which are provided in at least two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the power bars, leads, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and some of the leads being exposed in a common exterior surface of the package body. The bottom surface(s) of the power bar(s) may also be exposed in such common exterior surface of the package body, or the power bar(s) may be completely covered by the package body.

Claims

1. A semiconductor package, comprising:

a generally planar die pad defining multiple peripheral edge segments;

a plurality of power bars arranged to at least partially circumvent the die pad in spaced relation thereto;

a plurality of first leads disposed in spaced relation to the power bars and the die pad, the first leads being positioned inwardly of the power bars between the power bars and the die pad, with at least some of the first leads being electrically isolated from the die pad;

a plurality of second leads disposed in spaced relation to and positioned outwardly of the power bars, each of the second leads including first and second downsets formed therein in spaced relation to each other;

a plurality of third leads disposed in spaced relation to and positioned outwardly of the power bars, at least some of the third leads including a downset formed therein;

a semiconductor die attached to the die pad and electrically connected to at least one of each of the first, second and third leads, and to at least one of the power bars; and

a package body defining a generally planar bottom surface and multiple side surfaces, the package body at least partially encapsulating the first, second and third leads, the power bars, and the semiconductor die such that the first and second downsets of the second leads and the downsets of the third leads are covered by the package body, at least portions of the die pad, the first leads and the second leads are exposed in and substantially coplanar with the bottom surface of the package body, and portions of the third leads protrude from at least one of the side surfaces of the package body.

2. The semiconductor package of claim 1 wherein each of the third leads comprises:

an inner portion which is covered by the package, the inner portions of at least some of the third leads including a downset formed therein; and

an outer portion which protrudes from at least one of the side surfaces of the package body.

3. The semiconductor package of claim 1 wherein:

the die pad has a generally quadrangular configuration;

the first, second and third leads are segregated into at least four sets which each extend along and in spaced relation to a respective one of the peripheral edge segments of the die pad; and

four power bars are arranged so as to extend along and in spaced relation to respective one of the peripheral edge segments of the die pad.

4. The semiconductor package of claim 1 wherein four power bars are arranged so as to extend along and in spaced relation to the peripheral edge segments of the die pad.

5. The semiconductor package of claim 1 wherein:

at least two tie bars are connected to and protrude from the die pad;

each of the power bars extends between and in spaced relation to an adjacent pair of the tie bars; and

portions of the tie bars are exposed in the bottom surface of the package body.

6. The semiconductor package of claim 1 wherein portions of the power bars are exposed in the bottom surface of the package body.

7. The semiconductor package of claim 1 wherein each of the power bars is half etched and fully covered by the package body.

8. The semiconductor package of claim 1 wherein the semiconductor die is electrically connected to at least some of the first, second and third leads and at least one of the power bars by conductive wires which are covered by the package body.

9. The semiconductor package of claim 1 wherein:

each of the second leads includes a first segment, a second segment defining a wire bond zone, and a third segment, the first segment being disposed between the first downset and the die pad and defining a land which is exposed in the bottom surface of the package body, the first downset extending between the first and second segments, and the second downset extending between the second and third segments;

each of the third leads has inner and outer portions, the inner portion of each of the third leads including a first segment which defines a wire bond zone, and a second segment, the downset of each of the third leads extending between the first and second segments thereof; and

the conductive wires extend from the semiconductor die to respective ones of the wire bond zones of the second and third leads.

10. The semiconductor package of claim 9 wherein:

each of the first leads includes a top surface and a bottom surface defining a land which is exposed in the bottom surface of the package body; and

the conductive wires extend from the semiconductor die to the top surfaces of respective ones of the first leads.

11. The semiconductor package of claim 10 wherein:

the die pad, the first leads, the power bars, and the first segments of the second leads extend along a first plane;

the wire bond zones of the second and third leads each extend along a second plane which is disposed in spaced, generally parallel relation to the first plane; and

the third segments of the second leads, the second segments of the inner portions of the third leads, and the outer portions of the third leads each extend along a third plane which is disposed in spaced, generally parallel relation to the second plane such that the second plane extends between the first and third planes.

12. The semiconductor package of claim 10 wherein:

the die pad has a generally quadrangular configuration;

the first, second and third leads are segregated into at least four sets which each extend along and in spaced relation to a respective one of the peripheral edge segments of the die pad;

four power bars are arranged so as to extend along and in spaced relation to respective one of the peripheral edge segments of the die pad; and

the lands defined by the first leads of each set thereof are staggered relative to the lands defined by the second leads of a corresponding set thereof.

13. The semiconductor package of claim 12 wherein the inner portions of some of the third leads extend partially between an adjacent pair of second leads.

14. The semiconductor package of claim 1 wherein the bottom surface of the package body includes a plurality of grooves formed therein, some of the grooves extending between the power bars and the first leads, and some of the grooves extending between the power bars and the second leads.

15. A semiconductor package, comprising:

a die pad;

a power bar arranged in spaced relation with and generally parallel to a peripheral edge segment of the die pad;

a plurality of first leads disposed in spaced relation to the power bar and the die pad, the first leads being positioned generally perpendicularly inward of the power bar between the power bar and the die pad, with at least some of the first leads being electrically isolated from the die pad;

a plurality of second leads disposed in spaced relation to and positioned generally perpendicularly outward of the power bar;

a plurality of third leads disposed in spaced relation to and positioned outwardly of the power bar;

a semiconductor die attached to the die pad and electrically connected to at least one of each of the first, second and third leads, and to the power bar; and

a package body defining a generally planar bottom surface and multiple side surfaces, the package body at least partially encapsulating the first, second and third leads, the power bar, and the semiconductor die such that at least portions of the die pad, the first leads and the second leads are exposed in and substantially coplanar with the bottom surface of the package body, and portions of the third leads protrude from at least one of the side surfaces of the package body.

16. The semiconductor package of claim 15 wherein:

the die pad defines multiple peripheral edge segments; and

a plurality of power bars are arranged to at least partially circumvent the die pad in spaced relation thereto.

17. The semiconductor package of claim 16 wherein:

the die pad has a generally quadrangular configuration;

the first, second and third leads are segregated into at least four sets which each extend along and in spaced relation to a respective one of the peripheral edge segments of the die pad; and

the plurality of power bars are arranged so as to extend along and in spaced relation to respective one of the peripheral edge segments of the die pad.

18. The semiconductor package of claim 15 wherein a portion of the power bar is exposed in the bottom surface of the package body.

19. The semiconductor package of claim 15 wherein the power bar is half etched and fully covered by the package body.