System and method for affecting flux of multi-pole magnetic structures

• US 8,576,036 B2
• Filed: 12/09/2011
• Issued: 11/05/2013
• Est. Priority Date: 12/10/2010
• Status: Active Grant

• Current Assignee: Correlated Magnetics Research, LLC
• Original Assignee: Correlated Magnetics Research, LLC
• Inventors: Fullerton, Larry W., Roberts, Mark D.
• Primary Examiner(s): Enad, Elvin G
• Assistant Examiner(s): HOMZA, LISA NHUNG
• Application Number:
  US13/374,074
• Publication Number:
  US 20120146752A1
• Time in Patent Office: 697 Days
• Field of Search: 335/285, 335/296, 335302-306
• US Class Current: 335/306
• CPC Class Codes: H01F 3/12 Magnetic shunt paths
• CPC Class Codes: H01F 7/0205 Magnetic circuits with PM in general
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00

Abstract

A shunt plate is provided that is associated with a first side of a multi-pole magnetic structure. The shunt plate provides a magnetic short between opposite polarity magnetic sources on the first side of said magnetic structure, the magnetic short causing a magnetic flux of said opposite polarity magnetic sources to be routed from said first side of the magnetic structure through said magnetic structure to the second side of said magnetic structure. The thickness of the shunt plate is selected by determining the integrated flux across a magnetic source of the magnetic structure such that the corresponding flux density in the shunt plate does not substantially exceed the flux density saturation level of a cross section of the shunt plate.

Claims

1. A system for routing magnetic flux comprising:

a magnetic structure having a first thickness, said magnetic structure comprising a plurality of magnetic sources, said plurality of magnetic sources including opposite polarity magnetic sources having an opposite polarity orientation, said magnetic structure having a first side and a second side, said second side being opposite said first side, said plurality of magnetic sources extending from said first side of said magnetic structure to said second side of said magnetic structure; and

a shunt plate associated with said first side of said magnetic structure, said shunt plate providing a magnetic short between opposite polarity magnetic sources on said first side of said magnetic structure, said magnetic short causing a magnetic flux of said opposite polarity magnetic sources to be routed from said first side of said magnetic structure through said magnetic structure to said second side of said magnetic structure, said shunt plate having a second thickness less than said first thickness.

2. The system of claim 1, wherein said second thickness is less than one quarter of said first thickness.

3. The system of claim 1, wherein said second thickness is less than a tenth of an inch thick.

4. The system of claim 1, wherein said second thickness is less than a hundredth of an inch thick.

5. The system of claim 1, wherein said routing of said magnetic flux from said first side of said magnetic structure to said second side of said magnetic structure increases the density of said magnetic flux at said second side of said magnetic structure.

6. The system of claim 1, wherein said shunt plate allows only ten percent or less leakage of magnetic flux through said shunt plate.

7. The system of claim 1, wherein said shunt plate is in contact with said magnetic structure.

8. The system of claim 7, wherein said shunt plate is attached magnetically, attached using an adhesive, or attached via compression as result of a fixture interfacing with said magnetic structure.

9. The system of claim 1, wherein said shunt plate comprises a layer of metal applied to said first side of said magnetic structure using one of a thin-film deposition technique, a vapor deposition technique, or a sputter deposition technique.

10. The system of claim 1, wherein said shunt plate comprises a layer of metal applied to said first side of said magnetic structure using one of an electroplating technique, a vacuum arc technique, or a plasma deposition technique.

11. The system of claim 1, wherein said shunt plate comprises powdered metal sintered onto said first side of said magnetizable material.

12. The system of claim 1, wherein said shunt plate comprises powdered metal within at least one of a paint material or an adhesive material.

13. The system of claim 1, wherein said shunt plate has at least one hole.

14. The system of claim 1, wherein said shunt plate is movable relative to said magnetic structure.

15. The system of claim 14, wherein said shunt plate can rotate relative to an axis.

16. The system of claim 1, wherein said shunt plate is flexible.

17. The system of claim 1, wherein said shunt plate is removable.

18. The system of claim 1, wherein the flux density saturation level of a cross section of said second thickness is greater than or equal to the integrated flux across a magnetic source of said plurality of magnetic sources of said magnetic structure.

19. The system of claim 1, wherein said second thickness is less than half of said first thickness.

20. The system of claim 1, wherein the flux density saturation level of a cross section of said second thickness is greater than or equal to the integrated flux across a magnetic source of said magnetic structure.