Physical quantity sensor including bonding wire with vibration isolation performance characteristics
First Claim
1. A physical quantity sensor comprising:
- a sensing portion;
a casing including a support portion opposed to an end wall of the sensing portion for supporting the sensing portion, the support portion defining a support surface adjacent to the end wall of the sensing portion;
a vibration isolating member disposed between the end wall and the support surface to join the sensing portion to the casing, the vibration isolating member being configured to reduce a relative vibration between the sensing portion and the casing;
an electrically conductive portion provided on the casing;
a pad provided on the sensing portion; and
a bonding wire electrically connecting the electrically conductive portion and the pad and including a bend to be convex in a direction opposite to the support surface, whereinthe bonding wire is configured to satisfy a relation of 20×
d≦
h, in which d is an outer diameter of the bonding wire and h is a height of the bonding wire from the pad to a highest point of the bend.
1 Assignment
0 Petitions
Accused Products
Abstract
A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.
17 Citations
5 Claims
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1. A physical quantity sensor comprising:
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a sensing portion; a casing including a support portion opposed to an end wall of the sensing portion for supporting the sensing portion, the support portion defining a support surface adjacent to the end wall of the sensing portion; a vibration isolating member disposed between the end wall and the support surface to join the sensing portion to the casing, the vibration isolating member being configured to reduce a relative vibration between the sensing portion and the casing; an electrically conductive portion provided on the casing; a pad provided on the sensing portion; and a bonding wire electrically connecting the electrically conductive portion and the pad and including a bend to be convex in a direction opposite to the support surface, wherein the bonding wire is configured to satisfy a relation of 20×
d≦
h, in which d is an outer diameter of the bonding wire and h is a height of the bonding wire from the pad to a highest point of the bend. - View Dependent Claims (2)
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3. A physical quantity sensor comprising:
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a sensing portion; a casing encasing the sensing portion therein, the casing providing a clearance between an inner surface thereof and an outer wall of the sensing portion; a vibration isolating member disposed in at least a portion of the clearance to join the sensing portion to the casing, the vibration isolating member being configured to reduce a relative vibration between the sensing portion and the casing; an electrically conductive portion provided on the casing; a pad provided on a surface of the sensing portion; and a bonding wire electrically connecting the electrically conductive portion and the pad and including a bend, wherein the bonding wire is configured to satisfy a relation of 20×
d≦
h, in which d is an outer diameter of the bonding wire, and h is a height of the bonding wire from the pad to a highest point of the bend. - View Dependent Claims (4)
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5. A physical quantity sensor comprising:
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a casing, an inner unit housed within the casing and including a sensor portion; a vibration isolating member disposed between the casing and the inner unit to join the inner unit to the casing, the vibration isolating member being configured to reduce a relative vibration between the inner unit and the casing; a bonding wire electrically connecting the inner unit and the casing and including a bend away from a bottom surface of the inner unit, wherein the bonding wire is configured to satisfy a relationship of 20×
d≦
h, in which d is an outer diameter of the bonding wire and h is a height of the bonding wire from the bottom surface of the inner unit to a point of the bend in the bonding wire farthest from the bottom surface of the inner unit.
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Specification