Method for manufacturing semiconductor light emitting element, and semiconductor light emitting element

• US 8,580,592 B2
• Filed: 12/17/2009
• Issued: 11/12/2013
• Est. Priority Date: 12/26/2008
• Status: Expired due to Fees

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Sakurai, Tetsuo
• Primary Examiner(s): Maldonado, Julio J
• Assistant Examiner(s): BACHNER, ROBERT G
• Application Number:
  US13/142,143
• Publication Number:
  US 20110260177A1
• Time in Patent Office: 1,426 Days
• Field of Search: 257/E21.53, 257/79, 438/46, 438/22, 438/29, 438/31, 438/42, 438/43.01, 372/43.01
• US Class Current: 438/46
• CPC Class Codes: H01L 21/0237 Materials
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 21/02576 N-type
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier

Abstract

Provided is a method for manufacturing a semiconductor light emitting element, which has a step wherein a substrate composed of a material different from that of a semiconductor layer is used and a III compound semiconductor layer is formed on the substrate, and can reduce the emission wavelength distribution (δ) of the obtained semiconductor light emitting layer. The method for manufacturing the semiconductor light emitting element having the III compound semiconductor layer is characterized in having: a compound semiconductor substrate forming step wherein at least one compound semiconductor layer is formed on the substrate and a compound semiconductor substrate having an amount of warpage (H) within the range of 50 μm≦H≦250 μm is formed; and a light emitting layer forming step wherein the light emitting layer composed of a plurality of III compound semiconductor layers is formed on the compound semiconductor substrate which has been formed.

Claims

1. A method for manufacturing a semiconductor light emitting element having a group III compound semiconductor layer, the method comprising:

a compound semiconductor substrate forming step that forms at least one compound semiconductor layer on a substrate to form a compound semiconductor substrate having an amount of warpage H within a range of 80 μ

m≦

H ≦

190 μ

m; and

a light emitting layer forming step that forms a light emitting layer composed of a plurality of group III compound semiconductor layers on the compound semiconductor substrate having been formed.

2. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein the group III compound semiconductor layer contains at least a group III nitride.

3. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein the diameter D of the substrate is selected from a range of 50 mm to 155 mm.

4. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein the thickness d of the substrate is selected from a range of 0.4 mm to 1.5 mm.

5. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein an amount of warpage H of the substrate is selected from a range of -10 μ

m H ≦

10 μ

m.

6. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein the substrate is made of a material different from a material of a group III compound semiconductor layer.

7. The method for manufacturing a semiconductor light emitting element according to claim 1, wherein the substrate is made of sapphire.

8. The method for manufacturing a semiconductor light emitting element according to claim 1, further comprising an intermediate layer forming step that forms an intermediate layer containing aluminum nitride compound in advance.

9. The method for manufacturing a semiconductor light emitting element according to claim 8, wherein the intermediate layer is formed on the substrate by sputtering.

10. A semiconductor light emitting element manufactured by the method for manufacturing a semiconductor light emitting element according to claim 1.