Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
First Claim
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1. A method of manufacturing a trench type semiconductor device, the method comprising:
- (i) providing a semiconductor substrate having first and second main surfaces opposite to each other, the semiconductor substrate having a heavily doped region of a first conductivity type at the second main surface and having a lightly doped region of the first conductivity type at the first main surface;
(ii) forming a terminal structure over the first main surface side, formation of the terminal structure including formation of;
(a) a gate electrode over the first main surface with a gate insulation layer interposed therebetween,(b) a body region of a second conductivity type at the first main surface adjacent to the gate electrode,(c) a source region of the first conductivity type in the body region, and(d) a body contact of the second conductivity type in the body region adjacent to the source region;
(iii) after formation of the terminal structure, forming a mesa and a trench in the semiconductor substrate extending from the first main surface, with the terminal structure disposed generally over the mesa, the mesa being adjacent to the trench and having a first sidewall surface and a second sidewall surface;
(iv) doping, with a dopant of the second conductivity type opposite to the first conductivity type, the first sidewall surface;
(v) doping, with a dopant of the second conductivity type, the second sidewall surface;
(vi) driving in the dopant at the first and second sidewall surfaces to respectively form a first doped region of the second conductivity type and a second doped region of the second conductivity; and
(vii) following steps (i)-(vi), filling the trench with at least one of a semi-insulating material, an insulating material, and a combination thereof.
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Abstract
Methods for manufacturing trench type semiconductor devices involve refilling the trenches after high temperature processing steps are performed. The methods allow thermally unstable materials to be used as refill materials for the trenches of the device. Trench type semiconductor devices containing thermally unstable refill materials are also provided. In particular, methods of manufacturing and devices of a trench type semiconductor devices containing organic refill materials are provided.
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17 Claims
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1. A method of manufacturing a trench type semiconductor device, the method comprising:
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(i) providing a semiconductor substrate having first and second main surfaces opposite to each other, the semiconductor substrate having a heavily doped region of a first conductivity type at the second main surface and having a lightly doped region of the first conductivity type at the first main surface; (ii) forming a terminal structure over the first main surface side, formation of the terminal structure including formation of; (a) a gate electrode over the first main surface with a gate insulation layer interposed therebetween, (b) a body region of a second conductivity type at the first main surface adjacent to the gate electrode, (c) a source region of the first conductivity type in the body region, and (d) a body contact of the second conductivity type in the body region adjacent to the source region; (iii) after formation of the terminal structure, forming a mesa and a trench in the semiconductor substrate extending from the first main surface, with the terminal structure disposed generally over the mesa, the mesa being adjacent to the trench and having a first sidewall surface and a second sidewall surface; (iv) doping, with a dopant of the second conductivity type opposite to the first conductivity type, the first sidewall surface; (v) doping, with a dopant of the second conductivity type, the second sidewall surface; (vi) driving in the dopant at the first and second sidewall surfaces to respectively form a first doped region of the second conductivity type and a second doped region of the second conductivity; and (vii) following steps (i)-(vi), filling the trench with at least one of a semi-insulating material, an insulating material, and a combination thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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