Deposition method and manufacturing method of light-emitting device

• US 8,581,234 B2
• Filed: 02/24/2009
• Issued: 11/12/2013
• Est. Priority Date: 02/29/2008
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Tanaka, Koichiro, Ibe, Takahiro, Seo, Satoshi
• Primary Examiner(s): Stark, Jarrett
• Assistant Examiner(s): Fan, Michele
• Application Number:
  US12/391,785
• Publication Number:
  US 20090221107A1
• Time in Patent Office: 1,722 Days
• Field of Search: 438/22, 438/29, 438/758, 257/E33.001, 257/E21.211
• US Class Current: 257/29
• CPC Class Codes: C23C 14/048 using irradiation by energy or particles
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

Part of a material layer is deposited on a deposition target surface of a second substrate by steps of providing a first substrate having a light absorption layer and a material layer in contact with the light absorption layer over one of surfaces; making a surface of the first substrate over which the material layer is formed and a deposition target surface of a second substrate face to each other; depositing part of the material layer on the deposition target surface of the second substrate in such a manner that irradiation with laser light of which repetition rate is greater than or equal to 10 MHz and pulse width is greater than or equal to 100 fs and less than or equal to 10 ns is performed from the other surface side of the first substrate to selectively heat part of the material layer overlapping with the light absorption layer.

Claims

1. A deposition method comprising the steps of:

forming a plurality of light absorption layers over a first surface of a first substrate;

forming a material layer over the first surface of the first substrate so that the material layer covers the plurality of the light absorption layers;

making the first surface of the first substrate and a deposition target surface of a second substrate face each other; and

irradiating opposite to the first surface of the first substrate with a laser, whereby apart of the material layer is deposited on the deposition target surface of the second substrate,

wherein the part of the material layer overlaps and is in direct contact with the plurality of the light absorption layers,

wherein the part of the material layer is selectively heated by irradiating with the laser through the plurality of the light absorption layers, and

wherein different thicknesses of the material layer is deposited on the deposition target surface of the second substrate in one deposition step, without changing an intensity of the laser, by controlling each thickness of the plurality of light absorption layers.

2. The deposition method according to claim 1, wherein each of the plurality of the light absorption layers has a reflectance of less than or equal to 70% with respect to light.

3. The deposition method according to claim 1, wherein the each thickness of the plurality of the light absorption layers is greater than or equal to 10 nm and less than or equal to 600 nm.

4. The deposition method according to claim 1, wherein the material layer comprises an organic compound.

5. The deposition method according to claim 1, wherein each of the plurality of light absorption layers has an island shape, a rectangular shape, a stripe shape, or a hexagonal shape, and contains one of a metal nitride, metal, and carbon.

6. The deposition method according to claim 1,

wherein the laser has a repetition rate which is greater than or equal to 10 MHz and a pulse width which is greater than or equal to 100 fs and less than or equal to 10 ns,

wherein the first substrate is scanned with the laser, and

wherein the scanning with the laser is performed by moving the first substrate and the second substrate by a substrate moving means.

7. A deposition method comprising the steps of:

forming a light absorption layer over a first surface of a first substrate;

forming a material layer over the first surface of the first substrate so that the material layer covers the light absorption layer;

making the first surface of the first substrate and a deposition target surface of a second substrate face each other; and

irradiating opposite to the first surface of the first substrate with a laser, whereby a part of the material layer is deposited on the deposition target surface of the second substrate,

wherein the part of the material layer overlaps and is in direct contact with the light absorption layer,

wherein the part of the material layer is selectively heated by irradiating with the laser through the light absorption layer, and

wherein different thicknesses of the material layer is deposited on the deposition target surface of the second substrate in one deposition step, without changing an intensity of the laser, by controlling thicknesses of the light absorption layer.

8. The deposition method according to claim 7, wherein the light absorption layer has a reflectance of less than or equal to 70% with respect to light.

9. The deposition method according to claim 7, wherein the thicknesses of the light absorption layer is greater than or equal to 10 nm and less than or equal to 600 nm.

10. The deposition method according to claim 7, wherein the light absorption layer has an island shape, a rectangular shape, a stripe shape, or a hexagonal shape, and contains one of a metal nitride, metal, and carbon.

11. The deposition method according to claim 7, wherein the material layer is formed by a wet process.

12. The deposition method according to claim 7, wherein the material layer comprises an organic compound.

13. The deposition method according to claim 7, wherein a laser shape is linear or rectangular.

14. The deposition method according to claim 7,

wherein the laser has a repetition rate which is greater than or equal to 10 MHz and a pulse width which is greater than or equal to 100 fs and less than or equal to 10 ns,

wherein the first substrate is scanned with the laser, and

wherein the scanning with the laser is performed by moving the first substrate and the second substrate by a substrate moving means.

15. A method for manufacturing a light-emitting device comprising the steps of:

forming a plurality of light absorption layers over a first surface of a first substrate;

forming a material layer over the first surface of the first substrate so that the material layer covers the plurality of the light absorption layers;

forming an electrode over a second substrate;

making the first surface of the first substrate and a deposition target surface of the second substrate on the electrode face each other; and

irradiating opposite to the first surface of the first substrate with a laser, whereby a part of the material layer is deposited on the deposition target surface of the second substrate,

wherein the part of the material layer overlaps and is in direct contact with the plurality of the light absorption layers,

wherein the part of the material layer is selectively heated by irradiating with the laser through the plurality of the light absorption layers, and

wherein different thicknesses of the material layer is deposited on the deposition target surface of the second substrate in one deposition step, without changing an intensity of the laser, by controlling each thickness of the plurality of light absorption layers.

16. The method for manufacturing a light-emitting device according to claim 15, wherein each of the plurality of the light absorption layers has a reflectance of less than or equal to 70% with respect to light.

17. The method for manufacturing a light-emitting device according to claim 15, wherein the each thickness of the plurality of the light absorption layers is greater than or equal to 10 nm and less than or equal to 600 nm.

18. The method for manufacturing a light-emitting device according to claim 15, wherein the material layer comprises an organic compound.

19. The method for manufacturing a light-emitting device according to claim 15, wherein each of the plurality of light absorption layers has an island shape, a rectangular shape, a stripe shape, or a hexagonal shape, and contains any of metal nitride, metal, and carbon.

20. The method for manufacturing a light-emitting device according to claim 15, wherein the material layer contains either one or both of a light-emitting material and a carrier-transporting material.

21. The method for manufacturing a light-emitting device according to claim 15, wherein the electrode is an anode.

22. The method for manufacturing a light-emitting device according to claim 15,

wherein the laser has a repetition rate which is greater than or equal to 10 MHz and a pulse width which is greater than or equal to 100 fs and less than or equal to 10 ns,

wherein the first substrate is scanned with the laser, and

wherein the scanning with the laser is performed by moving the first substrate and the second substrate by a substrate moving means.

23. A method for manufacturing a light-emitting device comprising the steps of:

forming a light absorption layer over a first surface of a first substrate;

forming a material layer over the first surface of the first substrate so that the material layer covers the light absorption layer;

forming an electrode over a second substrate;

making the first surface of the first substrate and a deposition target surface of the second substrate on the electrode face each other; and

irradiating opposite to the first surface of the first substrate with a laser, whereby a part of the material layer is deposited on the deposition target surface of the second substrate,

wherein the part of the material layer overlaps and is in direct contact with the light absorption layer,

wherein the part of the material layer is selectively by irradiating with the laser through the light absorption layer, and

wherein different thicknesses of the material layer is deposited on the deposition target surface of the second substrate in one deposition step, without changing an intensity of the laser, by controlling thicknesses of the light absorption layer.

24. The method for manufacturing a light-emitting device according to claim 23, wherein the light absorption layer has a reflectance of less than or equal to 70% with respect to light.

25. The method for manufacturing a light-emitting device according to claim 23, wherein the thicknesses of the light absorption layer is greater than or equal to 10 nm and less than or equal to 600 nm.

26. The method for manufacturing a light-emitting device according to claim 23, wherein the light absorption layer has an island shape, a rectangular shape, a stripe shape, or a hexagonal shape, and contains one of a metal nitride, metal, and carbon.

27. The method for manufacturing a light-emitting device according to claim 23, wherein the material layer is formed by a wet process.

28. The method for manufacturing a light-emitting device according to claim 23, wherein the material layer comprises an organic compound.

29. The method for manufacturing a light-emitting device according to claim 23, wherein a laser shape is linear or rectangular.

30. The method for manufacturing a light-emitting device according to claim 23, wherein the material layer contains either one or both of a light-emitting material and a carrier-transporting material.

31. The method for manufacturing a light-emitting device according to claim 23, wherein the electrode is an anode.

32. The method for manufacturing a light-emitting device according to claim 23,

wherein the laser has a repetition rate which is greater than or equal to 10 MHz and a pulse width which is greater than or equal to 100 fs and less than or equal to 10 ns,

wherein the first substrate is scanned with the laser, and

wherein the scanning with the laser is performed by moving the first substrate and the second substrate by a substrate moving means.