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Buffer die in stacks of memory dies and methods

  • US 8,582,373 B2
  • Filed: 08/31/2010
  • Issued: 11/12/2013
  • Est. Priority Date: 08/31/2010
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a stack of memory dies directly connected to one another;

    a command die coupled to communicate with the stack of memory dies; and

    a first buffer die stacked within the stack of memory dies, and coupled between the command die and a downstream memory die in the stack of memory dies, wherein the first buffer die is configured to communicate with the command die, and repeat a signal between the command die and a downstream memory die in the stack of memory dies;

    a second buffer die stacked between the first buffer die and another downstream memory die in the stack of memory dies;

    wherein at least one of the first and second buffer dies is configured to communicate with a memory die above the respective buffer die in the stack of memory dies and is configured to communicate with a memory die below the respective buffer die in the stack of memory dies, and wherein the first and second buffer dies are configured to repeat memory signals.

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