Planarization of a material system in a semiconductor device by using a non-selective in situ prepared slurry
First Claim
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1. A method of planarizing a surface of a semiconductor device in the presence of a layer of silicon dioxide and a layer of silicon nitride, the method comprising:
- providing a first solution in a manufacturing environment, said first solution having a first pH value and comprising abrasive particles, wherein a percentage of said abrasive particles is between 6 weight percent and 9 weight percent;
providing a second solution in said manufacturing environment, said second solution comprising an acid;
producing a slurry solution in said manufacturing environment from at least said first and second solutions, said slurry solution having a second pH value between 6.5 and 8; and
performing a planarization process in said manufacturing environment using said slurry solution produced in said manufacturing environment, wherein, when performing said planarization process using said slurry solution, a difference between a removal rate of said layer of silicon dioxide and a removal rate of said layer of silicon nitride solution is less than 10% of the removal range of said layer of silicon dioxide.
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Abstract
For complex CMP processes requiring the removal of different dielectric materials, possibly in the presence of a polysilicon material, a slurry material may be adapted at the point of use by selecting an appropriate pH value and avoiding agglomeration of the abrasive particles. The in situ preparation of the slurry material may also enable a highly dynamic adaptation of the removal conditions, for instance when exposing the polysilicon material of gate electrode structures in replacement gate approaches.
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Citations
13 Claims
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1. A method of planarizing a surface of a semiconductor device in the presence of a layer of silicon dioxide and a layer of silicon nitride, the method comprising:
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providing a first solution in a manufacturing environment, said first solution having a first pH value and comprising abrasive particles, wherein a percentage of said abrasive particles is between 6 weight percent and 9 weight percent; providing a second solution in said manufacturing environment, said second solution comprising an acid; producing a slurry solution in said manufacturing environment from at least said first and second solutions, said slurry solution having a second pH value between 6.5 and 8; and performing a planarization process in said manufacturing environment using said slurry solution produced in said manufacturing environment, wherein, when performing said planarization process using said slurry solution, a difference between a removal rate of said layer of silicon dioxide and a removal rate of said layer of silicon nitride solution is less than 10% of the removal range of said layer of silicon dioxide. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of planarizing a surface of a semiconductor device in the presence of a layer of silicon dioxide and a layer of silicon nitride, the method comprising:
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providing a first solution in a manufacturing environment, said first solution having a first pH value and comprising abrasive particles, wherein a percentage of said abrasive particles is between 6 weight percent and 9 weight percent; providing a second solution in said manufacturing environment, said second solution comprising an acid; producing a slurry solution in said manufacturing environment from at least said first and second solutions, said slurry solution having a second pH value between 7 and 8; and performing a planarization process in said manufacturing environment using said slurry solution produced in said manufacturing environment while maintaining a concentration of abrasive particles within said slurry at a concentration level such that a ratio of a removal rate of said layer of silicon dioxide to a removal rate of said layer of silicon nitride falls within a range of 0.95-1.05. - View Dependent Claims (10, 11, 12, 13)
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Specification