Operation control device

• US 8,589,021 B2
• Filed: 12/26/2008
• Issued: 11/19/2013
• Est. Priority Date: 12/26/2008
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Noda, Hiroya, Asahara, Sukeo, Shimizu, Motoko
• Primary Examiner(s): Tran, Khoi
• Assistant Examiner(s): NGUYEN, ROBERT T
• Application Number:
  US13/141,999
• Publication Number:
  US 20110257836A1
• Time in Patent Office: 1,789 Days
• Field of Search: 701/13, 701/31.4
• US Class Current: 701/31.4
• CPC Class Codes: B64G 1/242 Orbits and trajectories
• CPC Class Codes: B64G 1/50 for temperature control
• CPC Class Codes: G01K 13/00 Thermometers specially adapted for specific purposes
• CPC Class Codes: G01K 2213/00 Temperature mapping
• CPC Class Codes: G01K 7/42 Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature

Abstract

An operation control device includes: a database for storing generated heat amount conditions of a device provided in a satellite and temperature environment conditions based on an orbital position and attitude of the satellite; a thermal analysis condition generation unit for generating thermal analysis conditions on the basis of telemetry data transmitted from the satellite, the generated heat amount conditions, and the temperature environment conditions; an analysis unit for performing thermal analysis for computing a temperature inside the satellite on the basis of the thermal analysis conditions; a temperature distribution data generation unit for generating temperature distribution data of part or all inside the satellite in a three-dimensional display format on the basis of the temperature values obtained by the thermal analysis; and a display unit for displaying the temperature distribution data.

Claims

1. An operation control device, comprising:

a database for storing generated heat amount conditions of a device provided in a satellite and temperature environment conditions based on an orbital position and attitude of the satellite;

a thermal analysis condition generation unit for generating thermal analysis conditions on the basis of telemetry data that represents temperatures actually measured by sensors provided in the satellite and is transmitted from the satellite, the generated heat amount conditions, and the temperature environment conditions;

an analysis unit for performing thermal analysis for computing a temperature inside the satellite on the basis of the thermal analysis conditions;

a temperature distribution data generation unit for generating temperature distribution data of part or all inside the satellite in a three-dimensional display format on the basis of the temperature values obtained by the thermal analysis; and

a display unit for displaying the temperature distribution data.

2. The operation control device according to claim 1, wherein the operation control device further includes a thermal analysis condition optimization unit for computing temperature differences between the temperature values obtained by the thermal analysis at fixed positions corresponding to placement positions of the temperature sensors and temperature values actually measured inside the satellite and contained in the telemetry data and instructing the thermal analysis condition generation unit to modify the thermal analysis conditions if the temperature differences are greater than a predetermined value.

3. The operation control device according to claim 1, wherein the temperature distribution data generation unit generates the temperature distribution data by displaying the temperature values obtained by the thermal analysis on a three-dimensional CAD model of the satellite.

4. The operation control device according to claim 1, wherein

the analysis unit stores a three-dimensional thermal analysis model of the satellite, and

the temperature distribution data generation unit generates the temperature distribution data by displaying the temperature values obtained by the thermal analysis on the three-dimensional thermal analysis model.

5. The operation control device according to claim 3, wherein the temperature distribution data generation unit embeds temperature sensor position information that represents the placement positions of the temperature sensors in the three-dimensional CAD model when the three-dimensional temperature distribution data is generated, and displays the temperature values actually measured and associated with the placement positions through the temperature sensor position information on the temperature distribution data.

6. The operation control device according to claim 4, wherein the temperature distribution data generation unit embeds temperature sensor position information that represents the placement positions of the temperature sensors in the three-dimensional thermal analysis model when the three-dimensional temperature distribution data is generated, and displays the temperature values actually measured and associated with the placement positions through the temperature sensor position information on the temperature distribution data.