Process for producing PTC device

• US 8,590,142 B2
• Filed: 12/07/2006
• Issued: 11/26/2013
• Est. Priority Date: 12/09/2005
• Status: Active Grant

• Current Assignee: Littelfuse Japan G.K. (Littelfuse Incorporated)
• Original Assignee: Tyco Electronics Raychem KK (TE Connectivity Ltd. (United Kingdom))
• Inventors: Tanaka, Arata, Suzuki, Katsuaki
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): Carley, Jeffrey T
• Application Number:
  US12/086,311
• Publication Number:
  US 20090223035A1
• Time in Patent Office: 2,546 Days
• Field of Search: 296/23, 298/60, 439/620.26
• US Class Current: 29/623
• CPC Class Codes: H01C 1/1406 Terminals or electrodes formed on resistive elements having positive temperature coefficient
• CPC Class Codes: H01C 17/281 by thick film techniques
• CPC Class Codes: H01C 7/027 consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
• CPC Class Codes: Y10T 29/49085 Thermally variable
• CPC Class Codes: Y10T 29/49107 Fuse making
• CPC Class Codes: Y10T 29/49179 by metal fusion bonding

Abstract

There is provided a polymer PTC device including a polymer PTC element having a lower resistance. The production process of a PTC device which includes a PTC element (102) having a polymer PTC component (110) and metal electrodes (104) placed on both sides thereto; and a lead (106) connected electrically to at least one of the metal electrodes, is characterized in that the polymer PTC component is formed of an electrically conductive polymer composition which comprises a polymer material and conductive fillers dispersed therein, and the connection of the lead to the metal electrode is performed at a temperature which is lower than the melting point of the polymer material.

Claims

1. A process of producing a PTC device which comprises

providing a PTC element having a polymer PTC component and metal electrodes placed on both sides thereto, the PTC component being formed of an electrically conductive polymer composition comprising a polymer material having a melting point and a conductive filler dispersed therein;

and

electrically connecting a lead to at least one of the metal electrodes-at a temperature which is lower than the melting point of the polymer material, the connection of the lead to the metal electrode being performed by an electrically conductive adhesive placed between the lead and the metal electrode, the electrically conductive adhesive comprising a thermosetting resin having a curing temperature lower than the melting point of the polymer material, and the lead being connected to the metal electrode by heating the conductive adhesive placed between the lead and the metal electrode so as to cure the thermosetting resin, the curing temperature of the thermosetting resin being at least 20°

C. lower than the melting point of the polymer material.

2. The process according to claim 1, wherein the curing temperature of the thermosetting resin is at least 30°

C. lower than the melting point of the polymer material.

3. The process according to claim 1, wherein the polymer material is a high density polyethylene, and the electrically conductive adhesive comprises an epoxy resin.

4. The process according to claim 1, wherein the polymer material is a polyvinylidene fluoride, and the electrically conductive adhesive comprises an epoxy resin.

5. The process according to claim 1, wherein the PTC device is obtained as a product by completing the connection of the lead to the metal electrode.