Light emitting diode light bar module with electrical connectors formed by injection molding

• US 8,591,251 B2
• Filed: 07/25/2012
• Issued: 11/26/2013
• Est. Priority Date: 10/07/2010
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: TSMC Solid State Lighting Ltd. (Epistar Corporation)
• Inventors: Lee, Hsiao-Wen, Sun, Chih-Hsuan, Yeh, Wei-Yu
• Primary Examiner(s): Duverne, Jean F
• Application Number:
  US13/557,315
• Publication Number:
  US 20120287635A1
• Time in Patent Office: 489 Days
• Field of Search: 439/487, 361/704
• US Class Current: 439/487
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/14262 Clamping or tensioning means for the insert
• CPC Class Codes: B29C 45/14311 using means for bonding the coating to the articles B29C45/14795 takes precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29K 2705/02 Aluminium
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members
• CPC Class Codes: Y10T 29/53 Means to assemble or disassemble

Abstract

The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

Claims

1. A light-emitting diode (LED) module, comprising:

a plurality of LED dies configured to emit light;

a heat sink thermally coupled to the plurality of LED dies;

a trench extending from a first end of the heat sink to a second end of the heat sink opposite the first end; and

a connector disposed at one of the first and second ends of the trench, the connector including a plurality of conductive pins surrounded by an injection molding material.

2. The LED module of claim 1, wherein the connector is a first connector, and wherein the LED module further comprises a second connector disposed at one of the first and second ends opposite from the first connector, the second connector being configured to mate with the first connector.

3. The LED module of claim 2, wherein the one of the first and second connectors is a male connector, and the other one of the first and second connectors is a female connector that contains a plurality of cavities that each correspond to a respective one of the pins of the male connector.

4. The LED module of claim 3, wherein:

the male connector protrudes out of the heat sink;

the female connector is approximately flush with the heat sink; and

the male and female connectors are coupled to the heat sink in a glue-free manner.

5. The LED module of claim 1, wherein the injection molding material and the heat sink have substantially similar coefficients of thermal expansion (CTE).

6. The LED module of claim 5, wherein:

the heat sink contains aluminum; and

the injection molding material contains polybutylene terephthalate (PBT) and glass fiber.

7. The LED module of claim 1, wherein the connector occupies one of the first and second ends of the trench in a manner that it forms a waterproof seal for the trench.

8. The LED module of claim 1, further comprising:

a printed circuit board (PCB) disposed in the trench, wherein the plurality of LED dies are disposed on the PCB;

a plurality of lenses each covering a respective one of the LED dies; and

a housing disposed over the PCB, the housing containing a plurality of openings that each expose a respective one of the lenses.

9. The LED module of claim 1, wherein:

the heat sink includes an elongate bar; and

the trench has a substantially rectangular cross-sectional profile.

10. A lighting module, comprising:

a heat sink extending in a longitudinal direction;

a recessed channel running through the heat sink along the longitudinal direction;

a printed circuit board (PCB) located in the recessed channel;

a plurality of light-emitting diode (LED) dies located on the PCB;

a male connector located in the recessed channel and coupled to a first end of the PCB, wherein the male connector includes a set of conductive pins circumferentially surrounded by a first injection molding element; and

a female connector located in the recessed channel and coupled to a second end of the PCB opposite the first end, wherein the female connector includes a component containing a set of holes, wherein each of the holes is configured to mate with a respective one of the conductive pins of the male connector, and wherein the component is circumferentially surrounded by a second injection molding element.

11. The lighting module of claim 10, wherein:

the male connector protrudes out of the heat sink in the longitudinal direction; and

the female connector is flush with the heat sink in the longitudinal direction.

12. The lighting module of claim 10, wherein:

the heat sink has a first coefficient of thermal expansion (CTE);

the first and second injection molding elements each have a second CTE; and

the first CTE is approximately equal to the second CTE.

13. The lighting module of claim 10, wherein:

the heat sink contains aluminum 6063-T5; and

the first and second injection molding elements each contain polybutylene terephthalate (PBT) filled with 30% glass fiber.

14. The lighting module of claim 10, wherein the first and second injection molding elements seal the recessed channel in a waterproof manner.

15. The lighting module of claim 10, further comprising:

a plurality of lenses located over the PCB and each covering a respective one of the LED dies; and

a housing disposed over the PCB, the housing containing a plurality of openings that each expose a respective one of the lenses.

16. The lighting module of claim 10, wherein the male and female connectors are coupled to the heat sink without glue.

17. A connector-heat sink apparatus of a light emitting diode (LED) light bar module comprising:

a plurality of LED dies configured to emit radiation;

a heat sink having a channel with an opening, the heat sink being thermally coupled to the plurality of LED dies and providing heat dissipation for the LED dies; and

an injection-molded connector disposed in the opening of the channel to form a waterproof seal with the channel of the heat sink, wherein the injection-molded connector includes injection molding materials and a set of conductor pins surrounded radially by the injection molding materials.

18. The connector-heat sink apparatus of claim 17, wherein the injection molding materials have a coefficient of thermal expansion (CTE) that is substantially the same as the CTE of the heat sink.

19. The connector-heat sink apparatus of claim 17, wherein the injection molding materials are polybutylene terephthalate (PBT) filled with 30% glass fiber and the heat sink is made from aluminum 6063.

20. The connector-heat sink apparatus of claim 17, wherein a product of a contact surface area between the injection molding materials and the channel of the heat sink multiplied by a strength of adhesive bonding per unit area between the injection molding materials and the channel of the heat sink is greater than a maximum shear force that the connector-heat sink apparatus needs to withstand.