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Substrate inductive devices and methods

  • US 8,591,262 B2
  • Filed: 09/03/2010
  • Issued: 11/26/2013
  • Est. Priority Date: 09/03/2010
  • Status: Active Grant
First Claim
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1. A multi-port connector, comprising:

  • a housing comprising a plurality of plug-receiving ports, the plug-receiving ports being arranged in a row-and-column fashion; and

    a substrate-based inductive device assembly, comprising;

    an insert assembly comprised of an insulative header and a plurality of plug-interfacing conductors, at least a portion of the plug-interfacing conductors in electrical communication with at least one substrate inductive device;

    a substrate inductive device comprised of a plurality of cores and a plurality of substrates, the substrates being arranged in a direction that is parallel to a plug insertion direction associated with the plug-receiving ports; and

    a plurality of circuit board interface terminals, the circuit board interface terminals in electrical communication with the at least one substrate inductive device;

    wherein at least two of the plurality of substrates are joined together via a plurality of conductive wires with a first portion of the conductive wires being disposed within an interior volume of a given core and a second portion of the conductive wires being disposed outside of an outer periphery of the given core;

    an interface substrate, the interface substrate disposed electrically between the insert assembly and the substrate inductive device;

    wherein the substrates include a first substrate comprised of a first plurality of apertures and a second substrate comprised of a second plurality of apertures, the conductive wires joining respective ones of the first apertures with the second apertures; and

    wherein the cores are disposed between the first and second substrates.

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