Debonding and transfer techniques for hetero-epitaxially grown graphene, and products including the same

• US 8,591,680 B2
• Filed: 07/11/2012
• Issued: 11/26/2013
• Est. Priority Date: 08/07/2009
• Status: Expired due to Fees

• Current Assignee: Guardian Glass LLC (KOCH Industries Incorporated)
• Original Assignee: Guardian Industries Corporation (KOCH Industries Incorporated)
• Inventors: Veerasamy, Vijayen S.
• Primary Examiner(s): Crispino, Richard
• Assistant Examiner(s): Royston, Elizabeth
• Application Number:
  US13/546,022
• Publication Number:
  US 20120312693A1
• Time in Patent Office: 503 Days
• Field of Search: 156/150, 205/188, 205/189, 205/319, 205/322, 205/333
• US Class Current: 156/150
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C01B 32/188 by epitaxial growth
• CPC Class Codes: C01B 32/194 After-treatment
• CPC Class Codes: C25F 5/00 Electrolytic stripping of metallic layers or coatings
• CPC Class Codes: C30B 29/02 Elements
• CPC Class Codes: C30B 33/00 After-treatment of single crystals or homogeneous polycrystalline material with defined structure C30B31/00 takes precedence

Abstract

Certain example embodiments of this invention relate to the use of graphene as a transparent conductive coating (TCC). In certain example embodiments, graphene thin films grown on large areas hetero-epitaxially, e.g., on a catalyst thin film, from a hydrocarbon gas (such as, for example, C₂H₂, CH₄, or the like). The graphene thin films of certain example embodiments may be doped or undoped. In certain example embodiments, graphene thin films, once formed, may be lifted off of their carrier substrates and transferred to receiving substrates, e.g., for inclusion in an intermediate or final product. Graphene grown, lifted, and transferred in this way may exhibit low sheet resistances (e.g., less than 150 ohms/square and lower when doped) and high transmission values (e.g., at least in the visible and infrared spectra).

Claims

1. A method of disposing a graphene thin film over a target receiving substrate, the method comprising:

hetero-epitaxially growing the graphene thin film on a catalyst thin film comprising a metal,

disposing the graphene thin film and the catalyst thin film, directly or indirectly, on the target receiving substrate; and

after said disposing, anodizing the catalyst thin film below the graphene so as to render the catalyst thin film a substantially transparent metal oxide.

2. The method of claim 1, wherein during the anodizing, the graphene thin film is caused to act as a cathode as the catalyst thin film is anodized.

3. The method of claim 1, wherein the catalyst film comprises nickel.

4. The method of claim 1, wherein the catalyst film comprises nickel and chromium.

5. The method of claim 1, wherein the catalyst film comprises 3-15% chromium.

6. The method of claim 1, wherein the catalyst film comprises vanadium.

7. The method of claim 1, wherein the catalyst film is supported by a back support.

8. The method of claim 7, wherein the back support comprises glass.

9. The method of claim 7, wherein the back support comprises a silicon wafer.

10. The method of claim 7, wherein the back support comprises zirconium.

11. A method of disposing a thin film comprising over a target receiving substrate, the method comprising:

hetero-epitaxially growing the thin film comprising graphene on a catalyst thin film comprising metal;

providing the thin film comprising graphene the catalyst thin film comprising metal, directly or indirectly, on the target receiving substrate; and

after said providing, anodizing the catalyst thin film comprising metal below the graphene so as to render the catalyst thin film a substantially transparent metal oxide.

12. The method of claim 11, wherein during the anodizing, the thin film comprising graphene is caused to act as a cathode as the catalyst thin film is anodized.

13. The method of claim 11, wherein the metal catalyst film comprises nickel.

14. The method of claim 11, wherein the metal catalyst film comprises nickel and chromium.

15. The method of claim 11, wherein the metal catalyst film comprises 3-15% chromium.

16. The method of claim 11, wherein the metal catalyst film comprises vanadium.

17. The method of claim 11, wherein the metal catalyst film is supported by a back support.

18. The method of claim 17, wherein the back support comprises glass.

19. The method of claim 17, wherein the back support comprises a silicon wafer.

20. The method of claim 17, wherein the back support comprises zirconium.