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Integrated circuit device

  • US 8,592,831 B2
  • Filed: 10/26/2006
  • Issued: 11/26/2013
  • Est. Priority Date: 02/06/1998
  • Status: Expired due to Fees
First Claim
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1. A packaged optoelectronic chip comprising:

  • (a) a die having a face, the die including at least one of a radiation emitter or a radiation receiver adjacent the face;

    (b) a transparent packaging layer having a major surface overlying the face of the die and an edge surface bounding the major surface, a first portion of the major surface being exposed at an exterior of the packaged chip; and

    (c) an opaque layer covering a second portion of the major surface of the transparent packaging layer adjacent the edge surface, such that the second portion is not exposed at an exterior of the packaged chip.

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