Integrated circuit device
First Claim
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1. A packaged optoelectronic chip comprising:
- (a) a die having a face, the die including at least one of a radiation emitter or a radiation receiver adjacent the face;
(b) a transparent packaging layer having a major surface overlying the face of the die and an edge surface bounding the major surface, a first portion of the major surface being exposed at an exterior of the packaged chip; and
(c) an opaque layer covering a second portion of the major surface of the transparent packaging layer adjacent the edge surface, such that the second portion is not exposed at an exterior of the packaged chip.
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Abstract
An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer.
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Citations
17 Claims
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1. A packaged optoelectronic chip comprising:
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(a) a die having a face, the die including at least one of a radiation emitter or a radiation receiver adjacent the face; (b) a transparent packaging layer having a major surface overlying the face of the die and an edge surface bounding the major surface, a first portion of the major surface being exposed at an exterior of the packaged chip; and (c) an opaque layer covering a second portion of the major surface of the transparent packaging layer adjacent the edge surface, such that the second portion is not exposed at an exterior of the packaged chip. - View Dependent Claims (2, 3, 4, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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- 5. A packaged chip as claimed in 1 further comprising contacts electrically connected to the die.
Specification