Tool management method of die bonder and die bonder
First Claim
1. A tool management method of a die bonder in which a part of a preform head by which a printed substrate is coated with a paste to bond a die, a part of a bonding head which picks up the die from a semiconductor wafer to be supplied to the printed substrate, and a part of a push-up unit which pushes up the die from the lower side when the bonding head picks up the die are replaceable as tools, the method comprising:
- (1) a step of attaching an RFID tag to any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit;
(2) a step of storing, into the RFID tag, information related to each tool to which the RFID tag is attached;
(3) a step of mounting any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit;
(4) a step of holding, in a first memory, information of the processing-target die of each tool that is input by an input device;
(5) a step of reading the information stored in the RFID tag attached to each tool by an RFID reader/writer that reads and writes data from/into the RFID tag using radio waves;
(6) a step of comparing, by an operational device, the information of the processing-target die of each tool that is held in the first memory with the information related to each tool that is stored in the RFID tag attached to each tool; and
(7) a step of displaying, if the comparison result in the step (6) shows that the both do not match each other, a determination result related to mounting of each tool on a display device by the operational device.
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Accused Products
Abstract
RFID tags are attached to tools of a preform head, a bonding head, and a push-up unit, and information related to each tool such as a dimension of a processing-target die is stored into the RFID tags. When a tool is mounted, an operator inputs manufacturing conditions related to the tool. When information related to the tool read from the RFID tag by an RFID reader/writer and the manufacturing conditions related to the tool do not match each other, a message about wrong mounting of the tool is displayed on a monitor. Further, an operation history of the tool is written into the RFID tag by the RFID reader/writer when the production is completed. The operation history is read when the next production is started, and if the values of the operation history exceed predetermined numbers of times, a message is displayed on the monitor.
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Citations
13 Claims
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1. A tool management method of a die bonder in which a part of a preform head by which a printed substrate is coated with a paste to bond a die, a part of a bonding head which picks up the die from a semiconductor wafer to be supplied to the printed substrate, and a part of a push-up unit which pushes up the die from the lower side when the bonding head picks up the die are replaceable as tools, the method comprising:
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(1) a step of attaching an RFID tag to any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit; (2) a step of storing, into the RFID tag, information related to each tool to which the RFID tag is attached; (3) a step of mounting any one of the tool of the preform head, the tool of the bonding head, and the tool of the push-up unit; (4) a step of holding, in a first memory, information of the processing-target die of each tool that is input by an input device; (5) a step of reading the information stored in the RFID tag attached to each tool by an RFID reader/writer that reads and writes data from/into the RFID tag using radio waves; (6) a step of comparing, by an operational device, the information of the processing-target die of each tool that is held in the first memory with the information related to each tool that is stored in the RFID tag attached to each tool; and (7) a step of displaying, if the comparison result in the step (6) shows that the both do not match each other, a determination result related to mounting of each tool on a display device by the operational device. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A die bonder comprising:
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any one or all of a first replaceable tool mounted in a preform head by which a printed substrate is coated with a paste to bond a die, a second tool mounted in a bonding head which picks up the die from a semiconductor wafer to be supplied to the printed substrate that is coated with the paste by the preform head, and a third tool mounted in a push-up unit which pushes up the die from the lower side when the bonding head picks up the die; a transmittable/receivable secondary device which is attached to each tool and stores information related to each tool to which the secondary device is attached; a primary device which can transmit and receive data to/from the secondary device, and reads and writes the information related to each tool stored in the secondary device; a first memory which stores information related to the die as a processing target of each tool; an operational device which compares the information related to the die stored in the first memory with the information related to each tool that is read through the primary device and is stored in the secondary device; and a display device which displays a comparison result of the operational device. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification