Measuring method, measuring apparatus, lithographic apparatus and device manufacturing method

• US 8,593,646 B2
• Filed: 02/09/2012
• Issued: 11/26/2013
• Est. Priority Date: 02/18/2011
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Den Boef, Arie Jeffrey, Beems, Marcel Hendrikus Maria, Cadee, Theodorus Petrus Maria, Lafarre, Raymond Wilhelmus Louis
• Primary Examiner(s): STAFIRA, MICHAEL PATRICK
• Application Number:
  US13/369,614
• Publication Number:
  US 20120212749A1
• Time in Patent Office: 656 Days
• Field of Search: 356614-624, 356399-401, 356445-448
• US Class Current: 356/614
• CPC Class Codes: G01B 11/00 Measuring arrangements characterised by the use of optical techniques
• CPC Class Codes: G01B 11/14 for measuring distance or clearance between spaced objects or spaced apertures G01B11/26 takes precedence; rangefinders G01C3/00
• CPC Class Codes: G02B 21/0048 scanning mirrors, e.g. rotating or galvanomirrors, MEMS mirrors
• CPC Class Codes: G02B 26/105 with one or more pivoting mirrors or galvano-mirrors G02B26/101 takes precedence
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

An apparatus (AS) measures positions of marks (202) on a lithographic substrate (W). A measurement optical system comprises illumination subsystem (504) for illuminating the mark with a spot of radiation (206) and as detecting subsystem (580) for detecting radiation diffracted by the mark. The substrate and measurement optical system move relative to one another at a first velocity (v_W) so as to scan the mark while synchronously moving the spot of radiation relative to the reference frame (RF) of the measurement optical system at a second velocity (v_SPOT). The spot scans the mark at a third velocity (v_EFF) which is lower than the first velocity to allow more time for accurate position measurements to be acquired. In one embodiment, an objective lens (524) remains fixed in relation to the reference frame while a moving optical element (562) imparts the movement of the radiation spot relative to the reference frame.

Claims

1. A method measuring a position of a mark on a substrate in an optical apparatus, the method comprising:

providing a mark on the substrate;

providing a measurement optical system comprising an illumination subsystem configured to illuminate the mark with a spot of radiation and a detecting subsystem configured to detect radiation diffracted by the mark;

in a scanning operation moving the substrate and the measurement optical system relative to one another at a first velocity so as to scan the mark with the spot of radiation while detecting and processing signals representing the diffracted radiation to calculate a position of the mark relative to a reference frame of the measurement optical system; and

synchronously with said scanning operation, moving the spot of radiation relative to the reference frame of the measurement optical system at a second velocity, the first and second velocities being related such that the spot scans the mark at a third velocity which is lower than the first velocity while said signals are detected.

2. The method of claim 1 wherein said first and second velocities are parallel, with the second velocity being lower than the first velocity, and the third velocity being equal to the first velocity minus the second velocity.

3. The method of claim 1 wherein said radiation spot is delivered to the substrate via an objective lens fixed in relation to the reference frame of the measurement optical system.

4. The method of claim 3 wherein the movement of the radiation spot relative to the reference frame of the measurement optical system is imparted by a moving optical element within the measurement optical system.

5. The method of claim 4 wherein said moving optical element is a mirror mounted to tilt about an axis, and wherein the axis lies at least approximately at the intersection of a plane of the mirror and a pupil plane of the objective lens.

6. The method of claim 4, wherein the moving optical element is mounted and driven so as to oscillate substantially in simple harmonic motion, said scanning operation being performed during a relatively linear portion of said simple harmonic motion.

7. The method of claim 1, wherein said illumination sub-system imparts a pattern of illumination that is not circularly symmetric about an optical axis of the measurement optical system, but exhibits 180°

rotational asymmetry.

8. The method of claim 7, wherein the detection subsystem calculates the position of the mark using first order diffracted radiation detected in a conjugate pupil plane of the measurement optical system.

9. An apparatus for measuring positions of marks on a substrate, the apparatus comprising:

a measurement optical system comprising an illumination subsystem configured to illuminate the mark with a spot of radiation and a detecting subsystem configured to detect radiation diffracted by the mark;

a first positioning subsystem configured to control movement of the substrate and measurement optical system relative to one another at a first velocity so as to scan the mark with the spot of radiation while detecting and processing signals representing the diffracted radiation to calculate a position of the mark relative to a reference frame of the measurement optical system;

a second positioning subsystem operable synchronously with the first positioning subsystem configured to move the spot of radiation relative to the reference frame of the measurement optical system at a second velocity, the first and second velocities being related such that the spot scans the mark at a third velocity which is lower than the first velocity while said signals are detected.

10. The apparatus of claim 9, wherein in operation said first and second velocities are parallel, with the second velocity being lower than the first velocity, and the third velocity being equal to the first velocity minus the second velocity.

11. The apparatus of claim 9, wherein said measurement optical system includes an objective lens for delivering said radiation spot to the substrate, the objective lens remaining fixed in relation to the reference frame of the measurement optical system.

12. The apparatus of claim 11, wherein the second positioning subsystem comprises a moving optical element within the measurement optical system for imparting the movement of the radiation spot relative to the reference frame of the measurement optical system.

13. The apparatus of claim 12, wherein said moving optical element is a mirror mounted to tilt about an axis, and wherein the axis lies at least approximately at the intersection of a plane of the mirror and a pupil plane of the objective lens.

14. The apparatus of claim 12, wherein the moving optical element is mounted so as to oscillate with a resonant frequency substantially matched to the second velocity.

15. The apparatus of claim 9, wherein said illumination sub-system is operable to impart a pattern of illumination which is not circularly symmetric about an optical axis of the measurement optical system, but exhibits 180°

rotational asymmetry.

16. The apparatus of claim 15, wherein the detection subsystem is arranged to calculate the position of the mark using first order diffracted radiation detected in a conjugate pupil plane of the measurement optical system.

17. The apparatus of claim 9, wherein the measurement optical system includes a self-referencing interferometer for rotating and recombining two portions of the diffracted radiation.

18. A lithographic apparatus arranged to transfer a pattern from a patterning device onto a substrate, the apparatus comprising:

a substrate table constructed to hold a substrate and an alignment sensor configured to measure the positions of marks on the substrate relative to a reference frame of the lithographic apparatus,

wherein the alignment sensor comprises a measuring apparatus having;

a measurement optical system comprising an illumination subsystem configured to illuminate the mark with a spot of radiation and a detecting subsystem configured to detect radiation diffracted by the mark;

a first positioning subsystem configured to control movement of the substrate and measurement optical system relative to one another at a first velocity so as to scan the mark with the spot of radiation while detecting and processing signals representing the diffracted radiation to calculate a position of the mark relative to a reference frame of the measurement optical system;

a second positioning subsystem operable synchronously with the first positioning subsystem configured to move the spot of radiation relative to the reference frame of the measurement optical system at a second velocity , the first and second velocities being related such that the spot scans the mark at a third velocity which is lower than the first velocity while said signals are detected, and

wherein the lithographic apparatus is arranged to control the transfer of a pattern onto the substrate by reference to the positions of marks on the substrate measured using said measuring apparatus.