Method and structure for optimizing heat exchanger performance

• US 8,593,811 B2
• Filed: 09/23/2011
• Issued: 11/26/2013
• Est. Priority Date: 04/05/2009
• Status: Active Grant

• Current Assignee: Dunan Microstaq, Inc. (Zhejiang Dun'an Artificial Environment Co., Ltd.)
• Original Assignee: Dunan Microstaq, Inc. (Zhejiang Dun'an Artificial Environment Co., Ltd.)
• Inventors: Price, Andrew R., Kaina, Rachid, Garnett, Mark C.
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US13/243,156
• Publication Number:
  US 20120140416A1
• Time in Patent Office: 795 Days
• Field of Search: 36167946-67953, 361/688, 361/689, 361/698, 361/699, 361701-712, 361/714, 361/715, 361717-724, 165/80.2, 165/80.4, 165/80.5, 165/104.19, 165/104.22, 165/104.33, 165/185, 165/148, 165/287, 257712-719, 251/11, 251/129.01, 251/129.04, 251/129.06, 251/129.07, 251/368, 251/331, 137/14, 137/596.12, 137/596.16, 137/596.17, 137/625.4, 137/625.42, 137/625.44, 137/625.45, 137/626.46, 137/828, 137/831, 137/833, 298/30, 298/900.3, 298/900.33, 298/900.39, 438/201, 438/122, 438/106, 438/422, 438/780, 438/458, 622/592
• US Class Current: 361/701
• CPC Class Codes: F28D 9/0093 Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
• CPC Class Codes: F28F 2210/02 with particular branching, e.g. fractal conduit arrangements
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 27/02 for controlling the distribution of heat-exchange media between different channels static flow control means in header boxes F28F9/026; arrangements of guide plates or guide vanes F28F9/22, F28F25/12
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 137/0396 Involving pressure control
• CPC Class Codes: Y10T 137/87209 Electric

Abstract

A heat exchanger structure including multiple fluid circuits, through which respective streams of a first fluid pass from a stream inlet to a stream outlet to transfer heat to or from a second medium. The fluid circuits are arranged into at least a first group and a second group, at least the first group consisting essentially of only fluid circuits that perform substantially similarly according to at least one selected performance criterion. A control sensor for at least the first group generates a signal representative of a parameter of the first fluid in the associated group. A valve for at least the first group is in fluid communication with of all the streams of the associated group so as to be able to control the flow of fluid through the streams of the associated group in parallel.

Claims

1. A micromachined device, comprising:

an integrated circuit including a portion which is heated during operation; and

a micromachined multi-circuit heat exchanger structure disposed for heat transfer between a fluid and the heated portion, including;

a plurality of micromachined fluid conduits into which a flow of the first fluid may be subdivided while flowing from a common inlet point to a common outlet point, the plurality of fluid conduits including at least a first group of two or more fluid conduits and a second group of fluid conduits, each of the fluid conduits within the first group performing generally similarly, the fluid conduits of the first group performing generally differently from the fluid conduits of the second group;

a first micromachined sensor generating a first signal representative of a parameter of the fluid in the first group of fluid conduits; and

a first microvalve device controlling flow of the fluid through the first group of fluid conduits based at least in part upon the first signal.

2. The micromachined device of claim 1, further including:

a second sensor generating a second signal representative of a parameter of the fluid, and

a fluid control device that comprises at least one of a valve, a pump, a flow restrictor, and a compressor that controls flow through at least the second group of fluid conduits based at least in part upon the second signal.

3. The micromachined device of claim 2, wherein the valve is a second microvalve device.

4. The micromachined device of claim 3, wherein the first microvalve device and the second microvalve device are disposed in a single package.

5. The micromachined device of claim 4, wherein the single package further includes the micromachined heat exchanger and the first and second micromachined sensors.

6. The micromachined device of claim 5, wherein the single package further includes the integrated circuit.

7. The micromachined device of claim 1, wherein the parameter is at least one of temperature, pressure, mass flow rate, volumetric flow rate, density, and energy content.

8. The micromachined device of claim 1, wherein each of the fluid conduits within the second group perform generally similarly.