Stacked CMOS power amplifier and RF coupler devices and related methods

• US 8,594,610 B2
• Filed: 10/19/2012
• Issued: 11/26/2013
• Est. Priority Date: 02/10/2010
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Misra, Abhay
• Primary Examiner(s): Lee, John J
• Application Number:
  US13/656,033
• Publication Number:
  US 20130045699A1
• Time in Patent Office: 403 Days
• Field of Search: 455/83, 455/127.1, 455/73, 455/106, 455/78, 455/333, 455/550.1, 455/82, 455/88, 455/334, 455/152.2, 455/343.1, 455/344, 455/77, 330/310, 330/285, 330/305
• US Class Current: 455/333
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H03F 2200/204 A hybrid coupler being used at the output of an amplifier circuit
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03F 3/24 of transmitter output stages
• CPC Class Codes: H03G 3/3042 in modulators, frequency-changers, transmitters or power amplifiers transmission power control in bidirectional transmission systems H04W52/04
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Stacked CMOS power amplifier (PA) and radio frequency (RF) coupler devices and related methods are disclosed. The stacked device includes a CMOS PA die configured to receive a transmit input signal and to output an amplified transmit signal, and a RF coupler device configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal. The CMOS PA die and the RF coupler device are stacked on top of and electrically coupled to each other, and the CMOS PA die and the RF coupler device are combined within a single semiconductor package. In some embodiments, the RF coupler device is positioned on top of the CMOS PA die, and in other embodiments the CMOS PA die is positioned on top of the RF coupler device.

Claims

1. A stacked CMOS power amplifier (PA) and radio frequency (RF) coupler device, comprising:

a CMOS power amplifier (PA) die configured to receive a transmit input signal and to output an amplified transmit signal; and

a radio frequency (RF) coupler device configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal;

wherein the CMOS PA die and the RF coupler device are stacked on top of and electrically coupled to each other; and

wherein the CMOS PA die and the RF coupler device are combined within a single semiconductor package.

2. The stacked CMOS PA and RF coupler device of claim 1, wherein the RF coupler device is positioned on top of the CMOS PA die.

3. The stacked CMOS PA and RF coupler device of claim 2, wherein the RF coupler device comprises a CMOS coupler device integrated directly on top of the CMOS PA die using a CMOS process.

4. The stacked CMOS PA and RF coupler device of claim 2, wherein the RF coupler device comprises a CMOS coupler device mounted on top of the CMOS PA die.

5. The stacked CMOS PA and RF coupler device of claim 4, further comprising one or more bond wires coupled between the CMOS PA die and the RF coupler device to provide an electrical connection.

6. The stacked CMOS PA and RF coupler device of claim 4, wherein the RF coupler device is electrically coupled to the CMOS PA die using flip-chip processing.

7. The stacked CMOS PA and RF coupler device of claim 1, wherein the CMOS PA die is positioned on top of the RF coupler device.

8. The stacked CMOS PA and RF coupler device of claim 7, wherein the RF coupler device comprises an RF coupler embedded within a ceramic package.

9. The stacked CMOS PA and RF coupler device of claim 8, wherein the CMOS PA die is mounted on top of the ceramic package.

10. The stacked CMOS PA and RF coupler device of claim 9, further comprising one or more bond wires coupled between the CMOS PA die and the ceramic package to provide an electrical connection between the CMOS PA die and the RF coupler.

11. The stacked CMOS PA and RF coupler device of claim 9, wherein the CMOS PA die is electrically coupled to the RF coupler within the ceramic package using flip-chip processing.

12. A method for making a stacked CMOS power amplifier (PA) and radio frequency (RF) coupler device, comprising:

providing a CMOS power amplifier (PA) die configured to receive a transmit input signal and to output an amplified transmit signal; and

providing a radio frequency (RF) coupler device configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal;

stacking the CMOS PA die and the RF coupler device on top of each other;

electrically coupling the CMOS PA die and the RF coupler device to each other; and

packaging the CMOS PA die and the RF coupler device into a single semiconductor package.

13. The method of claim 12, wherein the stacking step comprises positioning the RF coupler device on top of the CMOS PA die.

14. The method of claim 13, wherein the stacking step comprises integrating a CMOS RF coupler device directly on top of the CMOS PA die.

15. The method of claim 13, wherein the stacking step comprises mounting the RF coupler device on top of the CMOS PA die.

16. The method of claim 12, wherein the stacking step comprises stacking the CMOS PA die on top of the RF coupler device.

17. The method of claim 16, wherein the RF coupler comprises an RF coupler embedded within a ceramic package.

18. The method of claim 17, wherein the stacking step comprises mounting the CMOS PA on top of the ceramic package.

19. A method for making a stacked CMOS power amplifier (PA) and radio frequency (RF) coupler device, comprising:

providing a CMOS power amplifier (PA) die configured to receive a transmit input signal and to output an amplified transmit signal; and

directly integrating a radio frequency (RF) coupler device on top of the CMOS PA die, the RF coupler device being configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal; and

packaging the CMOS PA die and the RF coupler device into a single semiconductor package.