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Thermal management of a mobile device with ventless housing

  • US 8,595,517 B2
  • Filed: 09/01/2010
  • Issued: 11/26/2013
  • Est. Priority Date: 09/01/2010
  • Status: Active Grant
First Claim
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1. A mobile device comprising:

  • a housing having a plurality of surfaces, the housing being fabricated without vent holes;

    a processor located within the housing, a portion of at least one of the plurality of surfaces of the housing conducting heat away from the processor, wherein the portion corresponds to an area of the at least one surface having the highest temperature;

    a first temperature sensor thermally coupled to the processor for detecting a temperature of the processor;

    a battery located within the housing and electrically coupled to the processor;

    a second temperature sensor thermally coupled to the battery for detecting a temperature of the battery; and

    a third temperature sensor thermally coupled to the portion, the third temperature sensor detecting a temperature of the portion, the rate of energy consumption by the processor being adjusted based on the temperatures of the processor, the battery and the portion.

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