System and method for monitoring health of structural joints

• US 8,596,135 B2
• Filed: 06/12/2007
• Issued: 12/03/2013
• Est. Priority Date: 12/07/2006
• Status: Expired due to Fees

• Current Assignee: TECHNION RESEARCH AND DEVELOPMENT FOUNDATION, LTD.
• Original Assignee: UAB Research Foundation (University of Alabama System)
• Inventors: Karp, Baruch, Rittel, Daniel, Durban, David
• Primary Examiner(s): Chang, Leonard
• Assistant Examiner(s): HULS, NATALIE F
• Application Number:
  US12/519,243
• Publication Number:
  US 20100162825A1
• Time in Patent Office: 2,366 Days
• Field of Search: 737/81, 737/86, 737/88, 737/89, 702/34, 702/42
• US Class Current: 73/781
• CPC Class Codes: G01M 5/0033 by determining damage, crack or wear
• CPC Class Codes: G01M 5/0066 by exciting or detecting vibration or acceleration vibration testing of structures G01M7/00
• CPC Class Codes: G01N 2203/0064 Initiation of crack
• CPC Class Codes: G01N 2203/021 Treatment of the signal; Calibration
• CPC Class Codes: G01N 2203/0218 Calculations based on experimental data
• CPC Class Codes: G01N 2203/0244 Tests performed "in situ" or after "in situ" use
• CPC Class Codes: G01N 3/00 Investigating strength properties of solid materials by application of mechanical stress

Abstract

The present invention provides a system and a method monitoring the health of structural joints by monitoring the strain developed near the joint due to perturbation applied away from that joint and comparing the monitored ratio between near field and far field strain to strain ratio which develops in a healthy joint due to comparable perturbation. The system for monitoring joints comprises: at least one near field strain measuring device installed near a monitored joint for monitoring the induced strain; at least one far field strain measuring device installed away from monitored joint indicating, measuring or producing the perturbation; and a data processor connected to said near field strain measuring device and to said near field strain measuring device for analyzing the response of the structure to the perturbation and determining the integrity of said joint.

Claims

1. A system for monitoring joints comprising:

at least one joined member, having a width, wherein said joined member is joined to a structure by a monitored joint;

at least one near field strain measuring device located on said joined member, within a distance of less than the width of said joined member from said monitored joint;

at least one far field strain measuring device located on said joined member, at a distance of more than twice the width of said joined member away form said monitored joint; and

a computerized processor configured to;

receive data indicative of strain at said near field strain measuring device and said far field strain measuring device;

compute monitored signal signature based on the ratio of the data received from said near field strain measuring device and data received from said far field strain measuring device;

compare the monitored signal signature to a stored signal signature of a healthy joint; and

determine the integrity of said monitored joint based on the comparison of the monitored signal signature to the signal signature of a healthy joint.

2. The system of claim 1, wherein said near field, strain measuring device is a strain gage.

3. The system of claim 1, wherein said far field strain measuring device is a strain gage.

4. The system of claim 1, wherein at least one of said far field strain measuring device and said near field measuring device is a position sensor.

5. The system of claim 1, wherein at least one of said far field strain device and said near field measuring device is an accelerometer.

6. The system of claim 1, wherein said far field strain measuring device is an actuator.

7. The system of claim 6, wherein the actuator is a PZT actuator.

8. The system of claim 1 further comprising a second near field strain measuring device installed on said joined member, within a distance of less than width of said joined member from said monitored joint.

9. The system of claim 1 further comprising a second near field strain measuring device,

wherein said joined member is jointed to a second structure by a second monitored joint, and

wherein said second near field strain device is installed on said joined member, within a distance of less than the width of said joined member from said second monitored joint.

10. The system of claim 1, wherein monitoring joints comprises comparing readings of a near field strain measuring device and a far field strain measuring device to readings from an undamaged joint similar to the monitored joint.

11. The system of claim 1, wherein monitoring joints comprises comparing readings of a near field strain measuring device and a far field strain measuring device to stored readings from said monitored joint.

12. The system of claim 1, wherein monitoring joints comprises comparing readings of a near field strain measuring device and a far field strain measuring device to computed readings from mathematical model of the monitored joint.

22. The system of claim 1, wherein said joined member is a beam.

23. The system of claim 1, wherein said joined member is a plate.

13. A method for monitoring joints comprising:

receiving by a computerized processor data from at least one near field strain measuring device and at least one far field strain measuring device, positioned on a joined member, wherein;

said at least one joined member is joined to a structure by a monitored joint,

said at least one near field strain measuring device is located on said joined member, within a distance of less than the width of said joined member from a monitored joint, and

said at least one far field strain measuring device is located on said joined member, at distance of more than twice the width of said joined member from said monitored joint,

computing a monitored signal signature based on the ratio of the data received from said near field strain measuring device and the data received from said far field strain measuring device;

comparing the monitored signal signature to a stored signal signature of a healthy joint; and

determining an integrity of said monitored joint based on the comparison of the monitored signal signature to the signal signature of a healthy joint.

14. The method of claim 13, wherein said applied stress is static.

15. The method of claim 13, wherein said applied stress is dynamic.

16. The method of claim 13, wherein said applied stress is repetitive.

17. The method of claim 16, wherein said applied stress is harmonic.

18. The method of claim 13, wherein said applied stress is externally applied.

19. The method of claim 13, wherein said applied stress is caused by routine operation of said joint.

24. The method of claim 13, wherein said joined member is a beam.

25. The method of claim 13, wherein said joined member is a plate.

20. A method for identifying flaws in joint comprising:

receiving by a computerized processor data from at least one near field strain measuring device and at least one far field strain measuring device positioned on a joined member, wherein;

said at least one joined member is jointed to a structure by a monitored joint,

said at least one near field strain measuring device is located on said joined member, within a distance of less than the width of said joined member from a monitored joint, and

said at least one far field strain measuring device is located on said joined member, at distance of more than twice the width of said joined member from said monitored joint;

providing a signal signature of a healthy joint, substantially the type of said monitored joint, wherein said signal signature of a healthy joint is computed from the ratio of the data received from a near field strain measuring device and data received from a far field strain measuring device when stress is applied on a healthy joint substantially the type of said monitored joint;

providing a plurality of flawed signal signatures indicative of a differently flawed joint, wherein each of said flawed signal signatures is computed from the ratio of the data received from a near field strain measuring device and data received from a far field strain measuring device when stress is applied on a flawed joint substantially the type of said monitored joint;

acquiring signals from said at least one near field strain measuring device and said at least one far field strain measuring device, while said monitored joint is under stress;

computing monitored signal signature based on the ratio of the data received from said near field strain measuring device data received from said far field strain measuring device;

comparing said monitored signal signature with said signal signature of a healthy joint and said plurality of said signal signatures of a differently flawed joint; and

determining if said joint is healthy or flawed, and if flawed, which is the likely flaw.

21. The method of claim 20, wherein said applied stress is caused by routine operation of said joint.