Component of wireless IC device and wireless IC device

• US 8,596,545 B2
• Filed: 11/11/2010
• Issued: 12/03/2013
• Est. Priority Date: 05/28/2008
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Sasaki, Jun
• Primary Examiner(s): Le, Thien M
• Assistant Examiner(s): LY, TOAN C
• Application Number:
  US12/944,099
• Publication Number:
  US 20110062244A1
• Time in Patent Office: 1,118 Days
• Field of Search: 235/492, 235/492.41, 235/439, 340/12.51, 340/13.26
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.

Claims

1. A component of a wireless IC device, comprising:

a wireless IC chip; and

a feeding circuit substrate including at least one of a resonance circuit or a matching circuit including an inductance element coupled to the wireless IC chip;

wherein

the feeding circuit substrate is a multilayered substrate including a plurality of resin layers;

the inductance element is defined by a plurality of electrodes;

both of the wireless IC chip and the plurality of electrodes defining the inductance element are provided within the multilayered substrate;

connection portions between the wireless IC chip and the plurality of electrodes defining the inductance element are provided within the multilayered substrate;

the plurality of electrodes defining the inductance element include at least one annular electrode having an annular shape and including via hole conductors provided in the feeding circuit substrate;

a winding axis of the at least one annular electrode is perpendicular or substantially perpendicular to a lamination direction of the plurality of resin layers;

each of the via hole conductors is defined by a conductive material that is filled and cured in a hole in the plurality of resin layers; and

the wireless IC chip is disposed within an area of the feeding circuit substrate that is surrounded on at least two sides by a plurality of the via hole conductors.

2. The component of a wireless IC device according to claim 1, wherein the feeding circuit substrate includes a first main surface and a second main surface, and the at least one of the resonance circuit or the matching circuit is arranged between the wireless IC chip and the first main surface in a lamination direction of the plurality of resin layers and between the wireless IC chip and the second main surface in the laminated direction.

3. The component of a wireless IC device according to claim 1, wherein at least one stress alleviating electrode arranged to alleviate a stress on the wireless IC chip is arranged directly above and/or directly below the wireless IC chip.

4. The component of a wireless IC device according to claim 3, wherein

the feeding circuit substrate includes a flexible portion and a rigid portion;

the wireless IC chip is arranged in the rigid portion; and

the rigid portion is defined by a portion of the feeding circuit substrate in which the at least one stress alleviating electrode is disposed.

5. The component of a wireless IC device according to claim 1, wherein the at least one of the resonance circuit or the matching circuit includes capacitance elements defined by another plurality of electrodes that oppose one another.

6. The component of a wireless IC device according to claim 5, wherein the another plurality of electrodes defining the capacitance elements also define stress alleviating electrodes arranged to alleviate a stress on the wireless IC chip.

7. The component of a wireless IC device according to claim 1, wherein

the feeding circuit substrate includes a flexible portion and a rigid portion;

the wireless IC chip is arranged in the rigid portion.

8. The component of a wireless IC device according to claim 7, wherein the rigid portion is defined by a portion of the feeding circuit substrate in which the plurality of electrodes defining the inductance element are disposed.

9. A wireless IC device comprising:

the component of a wireless IC device according to claim 1; and

a radiation plate arranged to be electromagnetically coupled to the at least one of the resonance circuit or the matching circuit.

10. The wireless IC device according to claim 9, wherein a portion of the plurality of electrodes defining the inductance element is arranged in proximity to the radiation plate.

11. The wireless IC device according to claim 9, wherein a frequency of a signal that is transmitted and received in the radiation plate is substantially determined by a resonance frequency of the at least one of the resonance circuit or the matching circuit.