Endoscope apparatus

• US 8,597,179 B2
• Filed: 10/19/2010
• Issued: 12/03/2013
• Est. Priority Date: 07/23/2009
• Status: Active Grant

• Current Assignee: Olympus Corporation
• Original Assignee: Olympus Medical Systems Corporation (Olympus Corporation)
• Inventors: Kokubo, Mitsutaka
• Primary Examiner(s): Kasztejna, Matthew J
• Assistant Examiner(s): BARRY III, KEVIN GRANT
• Application Number:
  US12/907,297
• Publication Number:
  US 20110092769A1
• Time in Patent Office: 1,141 Days
• Field of Search: 600/109, 600/112, 600/160, 600/161, 600/169, 600174-176
• US Class Current: 600/169
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 1/127 with means for preventing fogging A61B1/253 takes precedence
• CPC Class Codes: A61B 1/128 provided with means for regulating temperature
• CPC Class Codes: G02B 23/2423 of the distal end

Abstract

An endoscope apparatus includes an insertion portion inserted into a body, an optical member arranged exposed from an outside surface at a distal end of the insertion portion, an objective optical system that condenses light impinged from the optical member, an electronic image pickup circuit that photoelectrically converts the light condensed by the objective optical system, a heat absorbing section arranged in the vicinity of the electronic image pickup circuit for absorbing heat generated from the electronic image pickup circuit, a heat transfer section extending toward the optical member side for transferring heat of the heat absorbing section, a heat radiation section arranged in the vicinity of the optical member for radiating heat transferred by the heat transfer section to the optical member, and a heat transfer member that is formed by patterning a metal foil on an insulating, flexible film member and includes the heat absorbing section, the heat transfer section and the heat radiation section.

Claims

1. An endoscope apparatus comprising:

an insertion portion inserted into a body;

an optical member as an observation window arranged exposed from an outside surface at a distal end of the insertion portion;

an objective optical system that condenses light impinged from the optical member;

an electronic image pickup circuit that photoelectrically converts photographing light condensed by the objective optical system;

a flexible film member disposed in the insertion portion and formed by an insulating, flexible member;

a heat absorbing section disposed at one end part of the flexible film and having a first metal pattern formed thereon, the first metal pattern being arranged opposed to the electronic image pickup circuit so as to encircle the electronic image pickup circuit and absorbing heat generated from the electronic image pickup circuit;

a heat radiation section disposed at the other end part of the flexible film member and having a second metal pattern formed thereon, the second metal pattern being adhered to the optical member in surface contact therewith at a position where the second metal pattern does not interfere with the photographing light to be condensed by the objective optical system and impinged on the electronic image pickup circuit on a rear surface of the optical member which is opposite to an exposed surface of the optical member, and the second metal pattern radiating heat transferred from the heat absorbing section to the optical member and adapted to prevent fogging, condensation or the like from occurring on the exposed surface of the optical member; and

a heat transfer section provided to connect the heat absorbing section and the heat radiation section between the one end part and the other end part of the flexible film member and having a third metal pattern formed thereon, the third metal pattern connecting the first metal pattern of the heat absorbing section and the second metal pattern of the heat radiation section to be capable of heat transfer.

2. The endoscope apparatus according to claim 1, further comprising:

a first support frame that holds the optical member;

a second support frame, part of a distal end of which engages with the first support frame, for holding an image pickup unit comprising the objective optical system, the electronic image pickup circuit or the like; and

an optical system holding frame that engages with a part closer to a proximal end portion than the part of the distal end of the second support frame and holds the objective optical system,

wherein the flexible film is arranged between the first support frame and the second support frame and between the second support frame and the optical system holding frame.

3. The endoscope apparatus according to claim 2, wherein a concave section in which the flexible film can be inserted and arranged is formed in the second support frame and the optical system holding frame.

4. The endoscope apparatus according to claim 1, wherein the heat radiation section is formed in a ring-shape with an opening that does not interfere with the photographing light, and adhered to an edge of the optical member in surface contact therewith.

5. The endoscope apparatus according to claim 1, wherein

the electronic image pickup circuit comprises a plurality of solid image pickup devices that perform photoelectrical conversion of the photographing light impinged and a plurality of image pickup processing circuits that process photographing signals photoelectrically converted by the plurality of solid image pickup devices;

and

a plurality of heat absorbing sections that absorb the heat generated by the plurality of solid image pickup devices and the plurality of image pickup processing circuits by individually encircling the plurality of solid image pickup devices and integrally encircling the plurality of image pickup processing circuits.

6. The endoscope apparatus according to claim 1, wherein the second metal pattern is exposed on at least one surface side thereof to radiate heat transferred from the first metal pattern to the optical member.

7. The endoscope apparatus according to claim 1, wherein the first metal pattern is exposed on at least one surface side thereof to absorb heat generated from the electronic image pickup circuit.

8. The endoscope apparatus according to claim 7, wherein the second metal pattern is exposed on at least one surface side thereof to radiate heat transferred from the first metal pattern to the optical member.