Solid metal block semiconductor light emitting device mounting substrates and packages

• US 8,598,606 B2
• Filed: 01/30/2009
• Issued: 12/03/2013
• Est. Priority Date: 10/25/2004
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H.
• Primary Examiner(s): HO, HOANG QUAN TRAN
• Application Number:
  US12/363,000
• Publication Number:
  US 20090134421A1
• Time in Patent Office: 1,768 Days
• Field of Search: None
• US Class Current: 257/98
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer

Abstract

A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes an insulating layer and a conductive layer on the insulating layer. The conductive layer is patterned to provide first and second conductive traces that connect to a semiconductor light emitting device. The second metal face may include heat sink fins therein. A flexible film including an optical element, such as a lens, also may be provided, overlying the semiconductor light emitting device.

Claims

1. A mounting substrate for a semiconductor light emitting device comprising:

a solid metal block including first and second opposing metal faces;

an insulating layer on the first metal face;

a conductive layer on the insulating layer that is patterned to provide first and second conductive traces on the first metal face;

at least one semiconductor light emitting device that is mounted on the first metal face and electrically connected to the first and second conductive traces;

a flexible film that includes an optical element therein on the first metal face, the flexible film extending adjacent the at least one semiconductor light emitting device, so that the at least one semiconductor light emitting device is between the optical element and the first metal face, and further extending on the first metal face beyond the at least one semiconductor light emitting device;

wherein the flexible film includes opposing faces on the first metal face beyond the at least one semiconductor light emitting device, that both conform to the first metal face beyond the at least one semiconductor light emitting device;

wherein the flexible film further includes opposing faces adjacent the at least one semiconductor light emitting device, that both conform to a surface of an underlying layer;

an attachment element that attaches the flexible film to the first metal face beyond the at least one semiconductor light emitting device, so that the optical element is unattached from the at least one semiconductor light emitting device; and

the second metal face including therein a plurality of metal heat sink fins.

2. A mounting substrate according to claim 1 wherein the solid metal block comprises a solid aluminum block and wherein the insulating layer comprises aluminum oxide.

3. A mounting substrate according to claim 1 wherein the solid metal block comprises a solid steel block and wherein the insulating layer comprises ceramic.

4. A mounting substrate according to claim 1 wherein the solid metal block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

5. A mounting substrate according to claim 1 wherein the optical element comprises a lens.

6. A mounting substrate according to claim 5 in further combination with a coating comprising phosphor on the lens, the coating comprising phosphor including opposing surfaces that both conform to a contour of the lens.

7. A mounting substrate according to claim 5 wherein the lens includes phosphor dispersed therein.

8. A mounting substrate according to claim 1 further comprising an integrated circuit on the solid metal block that is electrically connected to the first and second conductive traces.

9. A mounting substrate according to claim 1 further comprising a semiconductor light emitting device driver integrated circuit on the solid metal block that is electrically connected to the first and second conductive traces.

19. A mounting substrate according to claim 1 wherein the attachment element is located around a periphery of the flexible film.

20. A mounting substrate according to claim 1 wherein the attachment element is located at corners of the flexible film, but not between the corners of the flexible film.

21. A mounting substrate according to claim 1 wherein the attachment element comprises adhesive.

25. A mounting substrate according to claim 1 wherein the flexible film is a conformal flexible film.

26. A mounting substrate according to claim 1 wherein the flexible film is of uniform thickness on the first metal face beyond the at least one semiconductor light emitting device.

10. A mounting substrate for a semiconductor light emitting device comprising:

a solid block including first and second opposing faces;

a conductive layer on the first face that is patterned to provide first and second conductive traces on the first face;

at least one semiconductor light emitting device that is mounted on the first face and electrically connected to the first and second conductive traces;

a flexible film that includes an optical element therein on the first face, the flexible film extending adjacent the at least one semiconductor light emitting device so that the at least one semiconductor light emitting device is between the optical element and the first face, and further extending on the first face beyond the at least one semiconductor light emitting device;

wherein the flexible film includes opposing faces on the first face beyond the at least one semiconductor light emitting device, that both conform to the first face beyond the at least one semiconductor light emitting device;

wherein the flexible film further includes opposing faces adjacent the at least one semiconductor light emitting device, that both conform to a surface of an underlying layer; and

an attachment element that attaches the flexible film to the first face beyond the at least one semiconductor light emitting device, so that the optical element is unattached from the at least one semiconductor light emitting device.

11. A mounting substrate according to claim 10 wherein the solid block comprises a solid aluminum block.

12. A mounting substrate according to claim 10 wherein the solid block comprises a solid steel block.

13. A mounting substrate according to claim 10 wherein the solid block includes a through hole therein that extends from the first face to the second face and wherein the through hole includes a conductive via therein that is electrically connected to the first or second conductive traces.

14. A mounting substrate according to claim 10 wherein the optical element comprises a lens.

15. A mounting substrate according to claim 14 in further combination with a coating comprising phosphor on the lens, the coating comprising phosphor including opposing surfaces that both conform to a contour of the lens.

16. A mounting substrate according to claim 14 wherein the lens includes phosphor dispersed therein.

17. A mounting substrate according to claim 14 wherein the second face includes therein a plurality of metal heat sink fins.

18. A mounting substrate according to claim 10 further comprising a semiconductor light emitting device driver integrated circuit on the solid block that is electrically connected to the first and second conductive traces.

22. A mounting substrate according to claim 10 wherein the attachment element is located around a periphery of the flexible film.

23. A mounting substrate according to claim 10 wherein the attachment element is located at corners of the flexible film, but not between the corners of the flexible film.

24. A mounting substrate according to claim 10 wherein the attachment element comprises adhesive.

27. A mounting substrate according to claim 10 wherein the flexible film is a conformal flexible film.

28. A mounting substrate according to claim 10 wherein the flexible film is of uniform thickness on the first face beyond the at least one semiconductor light emitting device.