Electronic component and corresponding production method

• US 8,598,976 B2
• Filed: 06/16/2010
• Issued: 12/03/2013
• Est. Priority Date: 07/01/2009
• Status: Expired due to Fees

• Current Assignee: Isabellenhuette Heusler GmbH & Co. KG
• Original Assignee: Isabellenhuette Heusler GmbH & Co. KG
• Inventors: Hetzler, Ullrich
• Primary Examiner(s): LEE, KYUNG S
• Application Number:
  US13/381,783
• Publication Number:
  US 20120154104A1
• Time in Patent Office: 1,266 Days
• Field of Search: 338/49
• US Class Current: 338/49
• CPC Class Codes: G01R 1/203 Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts resistors in general H01C; microwave or radiowave terminations H01P1/26; coupling devices H01R
• CPC Class Codes: G01R 31/36 Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
• CPC Class Codes: H01C 1/14 Terminals or tapping points or electrodes specially adapted for resistors in general H01R; Arrangements of terminals or tapping points or electrodes on resistors
• CPC Class Codes: H01C 17/22 adapted for trimming
• CPC Class Codes: H01C 17/28 adapted for applying terminals
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01M 10/48 Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals, H01M50/569
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing

Abstract

The invention relates to an electronic component (1), in particular a low-ohm current-sense resistor, comprising at least one plate-shaped section (2, 3) and at least one terminal (7, 8) to electrically contact the plate-shaped section (2, 3). According to the invention, the terminals (7, 8) for measuring the voltage drop created by the current flow are formed by means of stamping and thread-shaping in the plate-shaped sections (2, 3).

Claims

1. An electronic component comprising:

a) at least one plate-shaped section and

b) at least one connecting contact for electric contacting of the plate-shaped section,

c) wherein the connecting contact is formed by an embossment in the plate-shaped section, wherein the embossment exhibits a thread in order to accommodate a screw.

2. The electronic component according to claim 1, wherein

the thread is an internal thread, and

the thread exhibits at least 5 thread turns.

3. Electronic component according to claim 1, wherein the embossment of the plate-shaped section protrudes to one side.

10. The electronic component according to claim 1, wherein the electronic component is selected from a group consisting of:

a) a passive component,

b) a discrete component,

c) a linear component,

d) a bipolar component,

e) a SMD component,

f) a resistor,

g) a fixed resistor,

h) a low-ohm current-sense resistor.

11. Current measuring module for the monitoring of a current with

a) a current-sense resistor according to claim 1, wherein the current-sense resistor is connected in series during operation to the load and measures the consumption current, and

b) an electronic evaluation unit, which measures the electric voltage that drops over the current-sense resistor between the two connecting contacts, wherein the evaluation unit is mechanically connected to the current-sense resistor.

12. Battery management module according to claim 11 for the monitoring of a battery.

23. The electronic component according to claim 1, wherein the electronic component is a low-ohm current sense resistor.

24. The electronic component according to claim 1, wherein the embossment contains a through-hole in the plate-shaped section.

25. The electronic component according to claim 24, wherein the thread is exhibited in the through-hole.

26. The electronic component according to claim 25, wherein the thread exhibits at least 5 thread turns.

4. An electronic component in the form of an electric current sense resistor, comprising:

a) two plate-shaped connecting parts made of a low-ohm conductor material,

b) a plate-shaped resistor element that is coupled electrically between the two connecting parts and consists of a resistor material that exhibits a greater specific resistance than the conductor material of the connecting parts, and

c) two connecting contacts for electric contacting of the two plate-shaped connecting parts and for measuring the electric voltage that drops over the resistor element, wherein the two connecting contacts are each formed by an embossment in the respective plate-shaped section.

5. The electronic component according to claim 4, wherein two connecting contacts are provided on the two connecting parts for the supply or discharging of an electric current to be measured.

6. The electronic component according to claim 4, wherein the resistor material is selected from a group consisting of:

a) high-ohmic material and low-ohmic material,

b) a copper alloy, a copper-manganese alloy, CuMn7Sn, CuMn3, CuMn12Ni, a copper-nickel alloy, CuNi15, CuNi10, CuNi6, CuNi44, CuNi2, CuNi1, a copper-nickel-manganese alloy, CuNi23Mn, CuNi30Mn,

c) a nickel alloy, a nickel-chrome alloy, in particular NiCr6015, NiCr20AlSi, NiCr8020, NiCr3020, a nickel-copper alloy, NiCu30Fe,

d) nickel, Ni99.2, Ni99.6, Ni99.98,

e) a nickel-iron alloy, NiFe30, Ni99.4Fe,

f) an iron-chrome alloy, FeCr25Al5.

7. The electronic component according to claim 4, wherein the conductor material is selected from a group consisting of copper, a copper alloy and aluminum.

8. The electronic component according to claim 4 wherein the resistor element is inserted between the two connecting parts, so that the two connecting parts are connected to the opposite side edges of the resistor element.

9. The electronic component according to claim 4, wherein the two connecting parts on the same side of the resistor element are spaced from one another and connected to a shared side edge of the resistor element.

13. Production method for an electronic component comprising the following steps:

a) Provision of at least one plate-shaped section of the component,

b) Forming of a connecting contact on the plate-shaped section for electric contacting of the plate-shaped section,

c) wherein the connecting contact is formed by an embossment in the plate-shaped section, further comprising the following additional step;

creation of a through-hole in the plate-shaped section by the embossment of the connecting contact.

14. Production method for an electronic component comprising the following steps:

a) Provision of at least one plate-shaped section of the component,

b) Forming of a connecting contact on the plate-shaped section for electric contacting of the plate-shaped section,

c) wherein the connecting contact is formed by an embossment in the plate-shaped section, further comprising the following step;

applying a thread in the embossment in order to accommodate a screw.

15. The production method according to claim 14, comprising the step of creation of a through-hole in the plate-shaped section by the embossment of the connecting contact, wherein at least one of the embossment, the through-hole and the thread is created in a single production step by the same machine.

16. Production method according to claim 14, wherein

a) the thread is an internal thread, and

b) the thread exhibits at least 5 thread turns.

17. Production method for an electronic component comprising the following steps:

a) provision of a resistor with two plate-shaped connecting parts made of a conductor material and a plate-shaped resistor element made of a resistor material, wherein the resistor element is coupled electrically between the connecting parts and is electrically and mechanically connected to the connecting parts,

b) embossment of one connecting contact, respectively, in both plate-shaped sections for electric contacting of the plate-shaped connecting parts.

18. The production method according to claim 17, further comprising the following steps for provision of the resistor

a) provision of one elongated band made of the resistor material,

b) provision of at least one elongated band made of the conductor material,

c) welding of the band made of the resistor material to the band made of the conductor material in the longitudinal direction of the band, so that a composite material band is generated,

d) separation of the resistor from the composite material band transversely to the longitudinal direction of the band.

19. The production method according to claim 18, wherein the band made of the resistor material is welded on each of its longitudinal edges to a band made of the conductor material resulting in the composite material band.

20. The production method according to claim 18, wherein the band made of the resistor material is welded to one single band made of the conductor material resulting in the composite material band.

21. The production method according to claim 20, further comprising the following step after welding:

separation of sections of the composite material band, wherein the sections extend over the whole width of the band made of the conductor material.

22. Production method for an electronic component comprising the following steps:

a) Provision of at least one plate-shaped section of the component,

b) Forming of a connecting contact on the plate-shaped section for electric contacting of the plate-shaped section,

c) wherein the connecting contact is formed by an embossment in the plate-shaped section, wherein the embossment is formed by collar forming.